Various nanostructured forms of CuO
In particular, we focus on the fundamental properties and various nanostructured forms of CuO reported in the literature and summarize the different synthetic strategies. Precisely controlling the artificial process is critical because it helps obtain CuO nanostructures with manageable dimensions and morphology, which is crucial for getting corresponding unique properties. This, in turn, enables a variety of promising applications that would not be possible for bulk material. This review aims to critically discuss essential factors that can affect the morphologies and size of CuO nanoproducts prepared by solution methods. The study can contribute some helpful information that helps to understand better the relation between synthetic process, final morphology, and the properties of corresponding CuO nanostructures. A better understanding of the fundamental properties of CuO nanostructures is essential for their application as building blocks for functional devices. The development of synthetic methods has been widely accepted to contribute to the entire study for understanding properties and realizing applications of nanoscale materials. It allows material scientists to control different parameters of the products, such as shape, particle size, size distribution, and composition. Numerous methods such as thermal evaporation, sonochemical, sol-gel, hydrothermal, and electrochemical methods, and microwave irradiation approaches have been developed to synthesize CuO nanostructures with diverse morphologies, sizes, and dimensions using various chemical, physical, or chemistry physics combined strategies. This paper focuses only on direct solution methods to successfully prepare copper (II)-oxide (Cu=O) nanostructures with different sizes, shapes, of their properties, and other applications in daily life and technology. If you are looking for high quality, high purity, and cost-effective Copper Oxide, or if you require the latest price of Copper Oxide, please feel free to email contact mis-asia.