How do you define it? Spherical Quartz Powder ? The sphere of quartz is made out of quartz crystal after it has been purified and fine ground. During a high-temperature field its phase, crystal forms and form change instantly from solid state into molten and finally back to solid state. Amorphous powder is made of irregularly formed angular particles that are transformed into regular spherical ones.
Here are some of the key features Spherical Quartz Powder
Smooth surface, large area and high stability of chemical properties are some of the benefits that spherical Quartz powder offers. Spherical quartz powder exhibits good fluidity and can be mixed well with resin to form a thin film. A higher amount of quartz powder is better for electronic components. It will also have a lower thermal conductivity. Also, the mold compound has a smaller thermal expansion factor. The stress of spherical granules is 60% less than that of angular powder. Furthermore, the mold made with spherical quartz crystal powder has the lowest stress concentration and highest strength. Spherical powder's surface is flat, has low friction and wears on molds. These factors can help extend mold life by up to one-third.

Spherical Quartz Powder Spherical SiO2 Property
Other Titles	Fused quartz, spherial quartz, spherical SiO2, silica
	7631-86-9
Compound Formula	SiO2
Molecular Weight	60.09
Appearance	Powder White
Melting Point	1,600deg C (2,912deg F)
Solubility In Water	N/A
Density	2533 kg/m3
Purity	99.5-99.9%
Bit Size	10-30nm
Boling Point	2,230deg C (4,046deg F)
Specific Heat	N/A
Thermo Conductivity	N/A
Thermal Expansion	N/A
Young's Module	N/A
Exact Mass	59.9668 g/mol
Monoisotopic	59.967 D

Spherical Quartz Powder Spherical SiO2

Spherical Quartz powder's uses
There are many uses for spherical powdered quartz, with electronic packaging being the most popular. Electronic packaging is an industry that supports integrated circuits. As integrated circuits become increasingly sophisticated, the demands for packaging materials increase. Packaging forms are continually optimized and improved to meet these requirements. Three main types of electronic packaging include substrate, plastic, glue, and frame. The advantages of plastic packaging include its ease-of-use, low cost and ability to be made in mass quantities. Plastic packaging is responsible for approximately 95% of all integrated circuits worldwide. %above. EMC is the main plastic encapsulant. It houses more than 95% microelectronic component.
1. Microelectronic packaging must be able to withstand high humidity, low stress, low pressure, low alpha-rays, dip and reflow welding resistances, as well as good sealing properties. To address this issue, epoxy molding compounds must contain inorganic fillers. Inorganic fillers are almost exclusively quartz micropowder, or silicon micropowder. Large-scale, ultra-large-scale microelectronics circuits now have more stringent requirements for packaging material. EMC powder, which is an important supporting material, requires quartz powder to be of the required particle size. Quartz powder also needs its purity.
2. It is a sphere of silicon micropowder that has a good form and can be used to meet the technical needs of high-end integrated systems. This can reduce the temperature expansion coefficient, dielectric constant, and stress of sealing materials. The products also have excellent weather resistance and impact resistance. This powder, which is mainly used in electronic packaging manufacturing, can be extensively used for the production of high-end cosmetics, electronic inks, laser fibers, electronic components and precision grinding, as well as in fillers in special paint coats.
The principal supplier Spherical Quartz Powder
Advanced material Tech Co., Ltd. is a professional oxide powder Over 12 years' experience in developing and researching chemical products. You can pay by Credit Card, T/T or West Union. We will send the items to overseas customers via FedEx or DHL.
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