Electrochemical Investigation of copper oxide films formed by oxygen plasma treatment


What is copper oxide?

Copper and Oxygen, when combined, form magnetic materials, including copper oxide (I) and copper oxide (ll); both minerals are found in nature and have unique characteristics and particular uses. Copper oxide (II), or cupric oxide, exists in nature as a component of minerals such as tenorite, paramelaconite, and extracted minerals worldwide. However, there is a process to produce it industrially. Copper Oxide is insoluble in water and soluble in ammonia solution. It is a compound that, when dissolved in hydrochloric acid, HCuCl 2 is obtained. It has a plethora of applications due to its remarkable characteristics. We will discuss all of such aspects in detail in this article.


Electrochemical investigation of copper oxide films formed by oxygen plasma treatment

Linear potential sweep voltammetry was used to characterize the copper oxides grown on a metal substrate when exposed to a low-pressure inductively coupled oxygen plasma. This study confirms the formation of a precursor oxide CuxO (x > 4), two copper(i) oxides Cu2-xO and Cu3O2, and copper(ii) oxide CuO. The electrochemical reduction curve of CuxO is characterized in aqueous solution (pH 9.2) by a minor peak near –0.5V vs. SCE, while the two Cu(i) oxides present one reduction peak at −0.8 VvsSCE and cannot be electrochemically separated; CuO is reduced to Cu(i) at −0.65V vs. SCE. The reduction potentials of the copper(i) and copper(ii) oxides vary with the oxide layer thickness, which increases with exposure time to the plasma and the injected electric power and decreases as the distance between the sample and the 1st coil increases for given treatment parameters. In addition, a mechanism is proposed to reduce thin films containing the copper(i) and copper(ii) oxides formed after plasma treatment.


Effect of copper oxide on the adhesion behavior of Epoxy Molding Compound copper interface

During processing and qualification, packages are subjected to significant temperature changes. A thermal cycling test is commonly applied for reliability qualification to determine the ability of components and interconnects to withstand mechanical stresses induced. Thermal oxidation of metal surfaces, especially on copper leadframe, is unavoidable. This study investigates delamination between Epoxy Molding Compound (EMC) and copper lead frame using the button shear test and the X-ray Photoelectron Spectroscopy (XPS) technique. The button shear samples were subjected to thermal cycling under JEDEC standards. The shear test was conducted on the model after the thermal cycling. After molding, a thin copper oxide film is formed on the leadframe across the EMC-leadframe interface. Other investigators have investigated the change in adhesion between the oxide film and EMC as a function of the copper oxide's thickness and chemical content.


Price of copper oxide

Copper oxide particle size and purity will affect the product's Price, and the purchase volume can also affect the cost of Copper oxide. A large amount of large amount will be lower. The Price of copper oxide is on our company's official website.


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