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Advanced materials: electronic devices "smart sweating" to solve their own heat dissipation problems

with the development of semiconductor technology a variety of semiconductor functional devices (including computing chips LEDs solar cells etc.) play an increasingly important role in the field of energy information other fields. However due to the limitation of efficiency most of the energy consumed by these high-energy density devices is usually converted into heat energy. If the heat energy can not be dissipated in time it will be destroyed The temperature of the device increases rapidly. The properties of PN junction of semiconductor devices are very sensitive to temperature. High temperature not only affects the performance stability of devices but also brings the problems of safety service life. Therefore heat dissipation has become one of the core problems of modern electronic devices.

have passive active cooling technologies. Active cooling (including air cooling water cooling) usually has complex structure high energy consumption so it is difficult to be applied in the increasingly popular miniaturized electronic devices (such as smart phones VR glasses etc.). Passive cooling technology generally has low cooling capacity it is difficult to meet the cooling needs of electronic equipment.

are aimed at this problem. Wuhan University researcher Liu Fu Professor Hu Xuejiao Professor Chen Jun of University of California at Los Angeles design develop a simple universal effective low-cost passive hydrogel thin film cooling technology. The key material is polyacrylamide hydrogel membrane which is rich in lithium ion bromine ion. The hydrogel film has two important thermal properties. First it can maintain its own water well under environmental conditions overcome the problem that traditional hydrogel will continue to lose water become dry under environmental conditions. Two when the temperature rises the hydrogel film evaporates loses a part of the water. However when the temperature drops the hydrogel film will absorb steam from the air to restore itself to the initial state. The nature of water loss is related to the concentration of ions inside the gel.

Relying on this property

can achieve “intelligent sweating” of electronic devices: if the film is covered on the heated electronic devices the moisture in the film will quickly evaporate take away the heat effectively reducing the temperature of semiconductor devices improving the energy efficiency of devices like human sweating mechanism; when the electronic devices do not work the film can spontaneously absorb from the surrounding environment Water vapor replenish their own moisture return to the initial state. This cooling design integrates active heat dissipation capability passive passive structure into a gel film providing a new cooling idea for future electronic design. A 0.5 mm thick hydrogel will be put on a mobile phone analog chip which will reduce the normal working temperature of the chip by 15.2 oC the maximum power consumption of the mobile phone chip will increase by 45% at fixed temperature. The hydrogel film is placed under a commercial silicon solar panel. Under a solar light the temperature of the panel is reduced by 13-17 oC the efficiency of solar cells is increased from 14.5% to 15.5%. This shows the prospect of the scheme in the semiconductor industry the electronic design field. Relevant achievements of

are published online in advanced materials

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