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Industry partners develop technology for multi-standard modem

Veronica C. Silva | March 5, 2012
Single chip in modem can support some of the latest telecom standards.

Some of the leading names in ICT recently announced that they have developed intellectual property for a chip for a modem that can support some of the latest and forthcoming standards in telecommunications.

NTT DOCOMO, NEC, Panasonic Mobile Communications and Fujitsu said they have jointly developed the intellectual property for a single large-scale integration (LSI) chip for a multi-standard modem that supports GSM, W-CDMA, HSPA+ and LTE mobile standards.

Developing both hardware and software, the partners claim that their intellectual property now allows a single chip in mobile devices, instead of two. This single chip is energy-efficient, reducing power consumption by as much as 20 percent, and reduces production costs.

The chip has undergone performance evaluation, and tests have been conducted to ensure interconnectivity to the mobile networks of "major vendors". The LSI chip also meets the 3rd Generation Partnership Project (3GPP) specifications.

The LTE standard supports FDD (Frequency Division Duplexing) mode adopted by DOCOMO and TDD (Time Division Duplexing) mode expected to be adopted for LTE networks in China and other markets. This will help to further the development of advanced mobile devices by manufacturers worldwide.

For future developments, the industry partners are considering developing a multi-standard chip that is also compliant with the LTE-Advanced next-generation transmission standard.

No specific time frame has yet been set for the commercialisation of the chip although the companies said they expect to commercialise it in Japan and other countries "as quickly as possible" given the market demand for smaller and affordable mobile devices. The companies also mentioned planning to set up a joint venture while working with other industry players to pursue this development.


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