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Singapore government research arm leads copper research consortium

Jack Loo | March 27, 2013
Findings from the partnership can help improve reliability of semiconductor devices.

"Infineon has been part of the Copper Wire Bonding Consortium since it was first launched in 2010," said Guenter Mayer, senior director, Package Technology and Innovation, Infineon Technologies Asia Pacific. "Today, our interest lies in copper wire bond interconnect performance and reliability in semiconductors that can meet the stringent quality requirements of automotive and industrial applications."


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