SINGAPORE, 16 MARCH 2010 As part of its initiative to support reliable interconnection in semiconductor packaging through the use of gold bonding wire, the World Gold Council (WGC) is sponsoring a seminar entitled Materials Science of Wire Bonding & Wire Bond Reliability' in conjunction with SEMI at SEMICON China 2010.
WGC is funded by the world's leading gold mining companies.
Global industry elites will meet at SEMICON China 2010 on March 16-18, 2010 at Shanghai, China to prepare for the industry's next upturn, WGC said in a statement. The venue was selected as China continues to have the highest growth rate among all the key microelectronic markets in the world and is regarded as one of the first countries recovering from global recession.
Gold wire bonding
WGC stated that gold wire bonding is the industry standard for high reliability interconnection in the electronics industry. Each year millions of electronic devices trust in gold bonding wire to deliver reliable performance.
This seminar will help to educate and inform engineers about the cost-effective use of gold in semiconductor packaging, said Dr Richard Holliday, Director, Industrial at World Gold Council. A recent SEMI survey showed that semiconductor companies are considering a switch to copper, however there are serious reservations about product reliability and manufacturing productivity if this switch takes place. This seminar will provide useful and factual information about gold in the bonding wire process.
It will help the industry understand how gold can still be viewed as a cost effective choice in many applications and how gold's inherent material properties are best suited to the wire bonding process, he added.
For more information about the seminar please visit http://www.semi.org/SCCHINA-EN/index.htmor.
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