1. Mamiriro Emaitiro uye Synthesis yeRound Silica
1.1 Morphological Tsanangudzo uye Crystallinity
(Spherical Silica)
Round silica inoreva silicon dioxide (SiO TWO) zvidimbu zvakagadzirwa neyunifomu yepamusoro, pedyo-yakakwana spherical shape, kuvazivisa kubva kune zvakajairwa zvisizvo kana angular silica poda inotorwa kubva kune zvese-zvakasikwa masosi..
Aya mabheti anogona kuve amorphous kana crystalline, kunyangwe iyo amorphous fomu inotonga zvekutengesa zvikumbiro nekuda kwekuchengetedza kwayo kemikari yekutanga, kuderedzwa sintering tembiricha pamwero, uye kusavapo kwechikamu chekuchinja chinogona kukonzera microcracking.
The round morphology haina kujairika; inoda kugadzirwa nenzira yakadzorwa inotonga nucleation, kukura, uye pamusoro penzvimbo kuderedza simba.
Kusiyana ne quartz yakapwanyika kana silica yakasanganiswa, iyo inoratidzira mipendero yakaoma uye yakakura saizi inotenderera, spherical silica inoratidzira nzvimbo dzakatsetseka, high kurongedza ukobvu, uye isotropic zviito pasi pe mechanical kunetseka, zvichiita kuti ive yakanaka kune echokwadi maapplication.
Iyo bhiti saizi inowanzosiyana kubva pagumi ema nanometers kune akawanda mamicrometer, nekutonga kwakasimba pamusoro pekugovera saizi zvichiita kuti zvikwanise kutarisika kushanda zvakanaka mucomposite masisitimu.
1.2 Regulated Synthesis Pathways
Nzira yakakosha yekugadzira spherical silica ndiyo nzira yeStöber, sol-gel zano rakagadzirwa muma1960s rinosanganisira iyo hydrolysis uye condensation yesilicon alkoxides.– Kazhinji, tetraethyl orthosilicate (TEOS)– mune doro sarudzo ine ammonia semutyairi.
Nekugadzirisa parameters senge reactant kutarisa, mvura-kune-alkoxide chikamu, pH, tembiricha level, uye nguva yekuita, vatsvakurudzi vanogona kunyatsogadzirisa saizi yechidimbu, monodispersity, uye pamusoro penzvimbo chemistry.
Iyi tekinoroji inobereka zvakafanana zvakanyanya, non-agglomerated spheres ane superb batch-to-batch reproducibility, yakakosha pakugadzirwa kwemazuva ano.
Nzira dzakasiyana dzinosanganisira flame spheroidization, uko zvimedu zvesilica zvisina kuenzana zvinonyungudutswa uye zvinonatsiridzwa kuita matenderedzwa uchishandisa yakanyanya-tembiricha plasma kana moto kurapwa., uye emulsion-based mazano anobvumira encapsulation kana core-shell structuring.
Yekugadzira yakakura-yekutengesa, sodium silicate-based precipitation nzira dzinoshandiswawo, kushandisa inodhura-inoshanda scalability uchichengetedza yakakodzera sphericity uye kuchena.
Surface functionalization mukati kana mushure mekubatanidza– zvakadai sekudyara ne silanes– inogona kusuma zvikwata zvepanyama (e.g., amino, epoxy, kana vinyl) kuwedzera kuenderana nemapolymer matrices kana kuita kuti zvikwanise bioconjugation.
( Spherical Silica)
2. Zvishandiso Zvinoshanda uye Kubudirira Kwakanakira
2.1 Kuyerera, Loading Density, uye Rheological Habits
Pakati peimwe yeakakosha mabhenefiti e spherical silica ndeyekuyerera kwayo kwakasarudzika kunopesana neangular anofananidzira., chivako chakakosha mukugadzira hupfu, jekiseni kuumba, uye kuwedzera kugadzirwa.
Kusavapo kwemipendero inopinza kunoderedza interparticle rubbing, kubvumira gobvu, homogeneous kurongedza ine shoma isina nzvimbo nzvimbo, iyo inowedzera kutendeseka kwema mechanical uye thermal conductivity yemiti yekupedzisira.
Mune digital packaging, yakakwira kurongedza density yakatwasuka yakaenzana kudzikisa resin zvemukati mune encapsulants, kuwedzera kuchengetedzwa kwekupisa uye kuderedza coefficient yekuwedzera kwekushisa (CTE).
Uyezve, spherical bits inopa yakanaka rheological pekugara zvivakwa kune kuturika uye pastes, kuderedza viscosity uye kudzivirira kuveura kukora, iyo inovimbisa kupa kwakapfava uye yunifomu yekuvhara mukugadzira semiconductor.
Aya akadzorwa maitiro ekuyerera akakosha mumashandisirwo akadai seflip-chip underfill, uko kunodiwa kuiswa kwezvinhu uye kuzadza pasina-isina.
2.2 Mechanical uye Thermal Security
Spherical silica inoratidza yakanakisa mechaniki kusimba uye inoshanduka modulus, kuwedzera kune tsigiro yemapolymer matrices pasina kugadzira kushushikana kutarisisa pamakona akapinza.
Kana yakabatanidzwa mu epoxy resins kana silicones, inovandudza kusimba, shandisa resistance, uye dimensional kuchengetedzwa pasi pekupisa bhasikoro.
Yayo yakaderera kupisa kwekukura coefficient (~ 0.5 × 10 ⁻⁶/ K) inonyatsoenderana neiyo yesilicon wafers uye akadhindwa edunhu mabhodhi, kuderedza kusaenzana kwemafuta mumagetsi emagetsi.
Uyezve, round silica inochengetedza kutendeseka kwechimiro pamazinga ekushisa akakwira (zvinenge ~ 1000 ° C mune inert ambiences), zvichiita kuti ive yakakodzera kune yakakwirira-yakavimbika zvikumbiro mune aerospace uye mota dzemagetsi zvigadzirwa.
Iko kusanganiswa kwekuchengetedzwa kwemafuta uye magetsi ekudzivirira zviri nani kunowedzera kushandiswa kwayo muzvikamu zvemagetsi uye LED chigadzirwa kurongedza.
3. Zvishandiso muElectroniki Zvishandiso uye Semiconductor Indasitiri
3.1 Basa muElectroniki Chigadzirwa Packaging uye Encapsulation
Spherical silica chigadzirwa chehwaro mumusika wesemiconductor, inonyanya kushandiswa sekuzadza mune epoxy molding makomisheni (EMCs) ye chip encapsulation.
Kutsiva akajairwa asina kuenzana mafirita nematenderedzwa akadzoreredza chigadzirwa kurongedza hunyanzvi nekugonesa kurodha kukuru kwekuzadza. (> 80 wt%), kuwedzera mold kuyerera, uye yakadzikisa tambo inofamba mukati mekutamisa molding.
Kufambira mberi uku kunosimudzira miniaturization yemaseketi akabatanidzwa uye kukura kwezvirongwa zvepamberi senge system-in-package. (SiP) uye fan-out wafer-level chigadzirwa kurongedza (FOWLP).
Iyo yakatsetseka pamusoro penzvimbo yezvikamu zvakatenderedza zvakare inoderedza kuputika kwegoridhe rakatsetseka kana waya dzemhangura dzekubatanidza., kunatsiridza kunaka kwemudziyo uye kudzoka.
Uyezve, chimiro chavo che isotropic chinoita mamwe yunifomu yekushushikana kugovera, kuderedza njodzi ye delamination uye fracturing panguva yekupisa bhasikoro.
3.2 Shandisa muPolishing uye Planarization Maitiro
Mumakemikari mechanical planarization (CMP), yakatenderedza silica nanoparticles inoshanda sevamiriri vanoshatisa mune slurries akagadzirwa kupukuta silicon wafers, optical lenzi, uye magineti yekuchengetedza nzvimbo midhiya.
Maumbirwo avo mayunifomu uye saizi inovimbisa nguva dzose kubviswa kwechigadzirwa mazinga uye kushoma kwenzvimbo zvikanganiso senge makwara kana makomba..
Yepamusoro-yakagadziridzwa denderedzwa silica inogona kugadzirwa kune ruzivo pH nharaunda uye kunzwa, kuwedzera kusarudza pakati pezvinhu zvakasiyana-siyana pane wafer pamusoro penzvimbo.
Kurongeka uku kunogonesa kugadzirwa kwe multilayered semiconductor zvimiro zvine nanometer-scale flatness., chinodiwa chekuvandudza lithography uye gadget assimilation.
4. Arising uye Cross-Disciplinary Applications
4.1 Biomedical uye Diagnostic Inoita Kushandisa
Kupfuura zvigadzirwa zvemagetsi, round silica nanoparticles anoshandiswa zvakanyanya mubiomedicine nekuda kweiyo biocompatibility, nyore kuita functionalization, uye tunable porosity.
Vanoshanda sevanopa mishonga yekuendesa mishonga, uko zvinodzoreredza zvinozadzwa muzvimiro zvemesoporous uye zvinotangwa mukupindura zvinokurudzira zvakaita sepH kana enzymes..
Mune diagnostics, fluorescently classified silica spheres inoshanda seyakagadzikana, isiri-chepfu probe yekufungidzira uye biosensing, kudarika quantum dots mune kunyanya biological nharaunda.
Nzvimbo yavo inogona kusanganiswa nemasoja ekudzivirira chirwere, peptides, kana DNA yekutarisa kwakanangwa kwezvirwere kana kenza biomarkers.
4.2 Additive Production uye Compound Zvigadzirwa
Mu 3D kudhinda, kunyanya mune binder jetting uye stereolithography, spherical silica powders inowedzera hupfu hwemubhedha wehupfu uye kuwirirana kwepakati, kuunza kugadziriswa kwepamusoro uye simba remuchina mune zvakadhindwa porcelains.
Sechikamu chekusimudzira mune simbi matrix uye polymer matrix macomposites, inowedzera kuoma, kupisa kwekutarisa, uye kupfeka kuramba pasina kukanganisa processability.
Chidzidzo chetsvagurudzo chiri kuongororawo zvidimbu zvakasanganiswa– core-shell zvimiro zvine silica shells pamusoro pemagineti kana plasmonic cores– kune multifunctional zvinhu mukucherechedza uye nzvimbo yekuchengetedza simba.
Mukupedzisa, round silica inoratidza kuti morphological control sei pane micro- uye nanoscale inogona kushandura chigadzirwa chakajairika kuita chepamusoro-chinogonesa pane akasiyana siyana emazuva ano matekinoroji..
Kubva pakudzivirira ma microchips kuenda kumberi kwechirwere chekuongorora, kusanganiswa kwayo kwakasiyana kwemuviri, makemikari, uye rheological zvivakwa zvinoramba zvichifambisa budiriro mukutsvagisa kwesainzi uye engineering.
5. Provider
TRUNNANO mutengesi we tungsten disulfide ine pamusoro 12 makore echiitiko mu nano-kuvaka simba kuchengetedza uye nanotechnology kusimudzira. Inobvuma kubhadhara kuburikidza neCredit Card, T/T, West Union uye Paypal. Trunnano ichaendesa zvinhu kune vatengi mhiri kwemakungwa kuburikidza neFedEx, DHL, nemhepo, kana nomugungwa. Kana iwe uchida kuziva zvakawanda nezve organic silicon dioxide, ndapota inzwa wakasununguka kutibata nesu uye kutumira kubvunza([email protected]).
Tags: Spherical Silica, silicon dioxide, Silika
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