1. Nā ʻano hiʻohiʻona a me ka hoʻohui ʻana o ka silica poepoe
1.1 ʻO ka wehewehe ʻana a me ka Crystallinity
(Silika pōʻai)
ʻO ke silika pōʻai e pili ana i ke silika dioxide (SiO ELUA) nā ʻāpana i hana ʻia me kahi ʻano like ʻole, ʻano pōʻaipoe kokoke loa, ka ʻike ʻana iā lākou mai nā pauka silica maʻamau a i ʻole ka angular i loaʻa mai nā kumu kūlohelohe āpau.
Hiki i kēia mau ʻāpana ke amorphous a i ʻole crystalline, ʻoiai ʻo ka ʻano amorphous e hoʻomalu i nā noi pāʻoihana ma muli o kāna palekana kemika premium, hōʻemi ʻia ka pae wela o ka sintering, a me ka nele o nā hoʻololi ʻana i hiki ke kumu i ka microcracking.
ʻAʻole maʻamau ka morphology poepoe; pono e hoʻokō ʻia ma o nā kaʻina hana i hoʻoponopono ʻia e hoʻokele nucleation, ulu ana, a me ka hoemi ikehu ili.
ʻAʻole like me ka quartz i wāwahi ʻia a i ʻole ka silica i hoʻohui ʻia, e hōʻike ana i nā ʻaoʻao ʻokoʻa a me ka nui ākea, spherical silica hiʻohiʻona maheʻe ili, mānoanoa packing kiʻekiʻe, a me nā hana isotropic ma lalo o ka hopohopo mechanical, hana maikaʻi ia no nā noi pololei.
'Oko'a ka nui bit mai ka 10s o nanometer a i ka nui micrometers, me ka mana paʻa i ka hāʻawi ʻana i ka nui e hiki ai ke ʻike mua ʻia ka pono i nā ʻōnaehana composite.
1.2 Nā Ala Hoʻohui Hoʻoponopono ʻia
ʻO ka ʻenehana koʻikoʻi no ka hana ʻana i ka silica spherical ʻo ke kaʻina Stöber, kahi hoʻolālā sol-gel i hoʻomohala ʻia i nā makahiki 1960 e komo pū ana me ka hydrolysis a me ka condensation o nā alkoxide silika.– ʻO ka maʻamau ka tetraethyl orthosilicate (TEOS)– i kahi koho waiʻona me ka amonia ma ke ʻano he mea hoʻokele.
Ma ka hoʻoponopono ʻana i nā ʻāpana e like me ka reactant focus, ka huina wai-a-alkoxide, pH, pae wela, a me ka manawa pane, hiki i nā mea noiʻi ke hoʻolohe pono i ka nui o nā ʻāpana, monodispersity, a me kemika ili.
Hāʻawi kēia ʻenehana i ke ʻano like ʻole, nā pōʻai i hoʻohui ʻole ʻia me ka hoʻopuka hou ʻana o ka puʻupuʻu, mea nui no ka hana hou.
Loaʻa nā ala like ʻole i ka flame spheroidization, kahi e hoʻoheheʻe ʻia ai nā ʻāpana silica like ʻole a hoʻomaikaʻi ʻia i loko o nā pōʻai me ka hoʻohana ʻana i ka plasma wela kiʻekiʻe a i ʻole ka mālama ahi., a me nā hoʻolālā emulsion-based e ʻae ai i ka hoʻopili ʻana a i ʻole ka hoʻonohonoho ʻana i ka ʻōpū.
No ka hana kalepa nui, Hoʻohana pū ʻia nā ala ua pili i ka sodium silicate, me ka hoʻohana ʻana i ka scalability kūpono ʻoiai e mālama ana i ka sphericity kūpono a me ka maʻemaʻe.
Ka hoʻohana ʻana o ka ʻili i loko a i ʻole ma hope o ka synthesis– e like me ke kanu ʻana me nā silanes– hiki ke hoʻolauna i nā hui kūlohelohe (e.g., amino, epoxy, aiʻole vinyl) e hoʻoikaika i ka hoʻohālikelike me nā matrices polymer a i ʻole e hiki ai ke bioconjugation.
( Silika pōʻai)
2. Nā Pono Hana a me nā Pono Pono
2.1 Ka hiki ke kahe, Hoʻouka ʻana i ka Density, a me nā maʻamau Rheological
Ma waena o kekahi o nā pōmaikaʻi koʻikoʻi o ka silica spherical ʻo kona kahe kahe ʻokoʻa i hoʻohālikelike ʻia me nā mea angular., he waiwai pono i ka hana pauda, hoʻoheheʻe ʻia, a me ka hana hoʻohui.
ʻO ka loaʻa ʻole o nā ʻaoʻao ʻoi e hōʻemi ana i ka ʻōpala interparticle, ʻae mānoanoa, paʻi like ʻole me ka liʻiliʻi o ka ʻāpana ʻole, ka mea e hoʻonui i ka pono mechanical a me ka thermal conductivity o nā hui hope.
I loko o ka pahu kikohoʻe, ʻO ke kiʻekiʻe o ka puʻupuʻu puʻupuʻu pololei pololei e hōʻemi i ka ʻike resin i loko o nā encapsulants, hoʻonui i ka palekana wela a me ka hōʻemi ʻana i ka coefficient o ka hoʻonui wela (CTE).
Eia kekahi, Hāʻawi nā ʻāpana spherical i nā waiwai noho rheological maikaʻi i nā hoʻokuʻu a me nā paʻi., e hōʻemi ana i ka viscosity a me ka pale ʻana i ka mānoanoa shear, e hōʻoiaʻiʻo ana i ka hāʻawi maʻalahi a me ka uhi ʻaʻahu i ka hana semiconductor.
Pono kēia ʻano kahe i hoʻoponopono ʻia i nā noi e like me ka hoʻopiha piha ʻana i ka flip-chip, kahi e pono ai ka hoʻonohonoho pono ʻana o nā mea a me ka hoʻopiha ʻole ʻole.
2.2 Mechanical and Thermal Security
Hōʻike ka silica spherical i ka paʻakikī mechanical a me ka modulus maʻalahi, e hoʻohui i ke kākoʻo o nā matrices polymer me ka ʻole o ka hoʻoulu ʻana i ke koʻikoʻi ma nā kihi ʻoi.
Ke hoʻohui ʻia i loko o nā resins epoxy a i ʻole silicones, hoʻomaikaʻi i ka paʻa, hoʻohana kūʻē, a me ka palekana dimensional ma lalo o ke kaʻa uila wela.
ʻO kona haʻahaʻa haʻahaʻa ulu wela (~ 0.5 × 10 ⁻⁶/ K) pili loa i ka wafer silika a me na papa kaapuni pai, e hoʻemi ana i nā koʻikoʻi like ʻole wela i nā hāmeʻa microelectronic.
Eia kekahi, Mālama ka silica poepoe i ka pono o ka hale ma nā pae wela kiʻekiʻe (ma kahi o ~ 1000 ° C i loko o nā ʻano inert), kūpono ia no nā noi hilinaʻi kiʻekiʻe i ka aerospace a me nā mea uila uila.
ʻOi aku ka maikaʻi o ka hui ʻana o ka palekana wela a me ka insulation uila i kāna pono i nā ʻāpana mana a me nā huahana huahana LED.
3. Nā noi i nā ʻenehana uila a me nā ʻoihana semiconductor
3.1 Dute i loko o ka Electronic Product Packaging and Encapsulation
ʻO Spherical silica kahi huahana kumu i ka mākeke semiconductor, hoʻohana mua ʻia ma ke ʻano he mea hoʻopiha i nā pūhui epoxy molding (Nā EMC) no ka encapsulation chip.
ʻO ka hoʻololi ʻana i nā mea hoʻopihapiha maʻamau me nā mea poepoe ua hana hou i ka hana hoʻopihapiha hoʻopihapiha ma o ka hiki ʻana i ka hoʻouka ʻana i ka hoʻopiha piha. (> 80 wt%), hoʻonui ʻia ke kahe ʻana o ka mold, a hoʻohaʻahaʻa iho i ka neʻe ʻana o ke kaula i loko o ka hoʻololi ʻana.
Mālama kēia holomua i ka miniaturization o nā kaapuni i hoʻohui ʻia a me ka ulu ʻana o nā hoʻolālā holomua e like me ka system-in-package. (SiP) a me ka pahu hua wafer-level fan-out (FOWLP).
ʻO ka ʻili maʻemaʻe o nā ʻāpana poepoe e hōʻemi ana i ka abrasion o ke gula maikaʻi a i ʻole nā uea hoʻopaʻa keleawe, ka hoʻomaikaʻi ʻana i ka pono a me ka hoʻihoʻi.
Eia kekahi, ʻO ko lākou ʻano isotropic e hoʻokaʻawale i ke koʻikoʻi like ʻole, e hōʻemi ana i ka pilikia o ka delamination a me ka haʻihaʻi ʻana i ka wā kaʻa uila wela.
3.2 Hoʻohana i nā kaʻina hana hoʻoliʻiliʻi a hoʻolālā
I ka planarization mechanical kemikala (CMP), Hana ʻia nā nanoparticles silica ma ke ʻano he ʻelele abrasive i nā slurries i hana ʻia e hoʻolalelale i nā wafer silika., nā lens optical, a me ka pāpaʻi hoʻopaʻa manaʻo.
ʻO kā lākou ʻano like ʻole a me ka nui e hōʻoiaʻiʻo i nā helu hoʻopau maʻamau o ka huahana a me nā hapa liʻiliʻi o ka ʻili e like me nā ʻōpala a i ʻole nā lua..
Hiki ke hoʻopili ʻia ka silica puni i hoʻololi ʻia i ka ʻili no nā kikoʻī pH kaiapuni a me ka naʻau, e hoʻonui ana i ka koho ma waena o nā mea like ʻole ma kahi ʻāpana wafer.
Hiki i kēia pololei ke hana i nā hale semiconductor multilayered me ka pālahalaha nanometer-scale., he koi no ka lithography hou a me ka assimilation gadget.
4. Nā Palapala Hoʻopiʻi Kū aʻe
4.1 Hoʻohana ka Biomedical a me ka Diagnostic
Ma waho aʻe o nā mea uila, Hoʻohana nui ʻia nā nanoparticles silica i ka biomedicine ma muli o ko lākou biocompatibility, oluolu o functionalization, a me tunable porosity.
Hana lākou ma ke ʻano he mea hāʻawi lāʻau lapaʻau, kahi i hoʻopiha ʻia ai nā mea hoʻihoʻi hou i nā hale mesoporous a hoʻokuʻu ʻia i pane i nā mea hoʻoulu e like me ka pH a i ʻole nā enzymes..
I ka diagnostics, ʻO nā pōʻai silica i hoʻopaʻa ʻia i ka fluorescently e lawelawe ma ke ʻano paʻa, nā mea ʻawaʻawa ʻole no ke kiʻi ʻana a me ka biosensing, ʻoi aku ka maikaʻi o nā kiko kikoʻī ma nā kaiaola olaola.
Hiki ke hoʻohui ʻia ko lākou ʻili me nā antibodies, peptides, a i ʻole DNA no ka ʻike ʻana i nā pathogens a i ʻole nā mea biomarkers maʻi kanesa.
4.2 Hana Hoʻohui a me nā Huahana Hoʻohui
I ka paʻi 3D, ʻoi loa i ka binder jetting a me stereolithography, ʻO nā pauka silica spherical e hoʻonui i ka nui o ka moena pauda a me ka lokahi o ka papa, lawe mai i ka hoʻonā kiʻekiʻe a me ka ikaika mechanical i nā porcelains i paʻi ʻia.
Ma ke ʻano he hana hoʻonui i ka matrix matrix a me ka polymer matrix composites, hoʻonui i ka ʻoʻoleʻa, nānā wela, a hoʻopaʻa i ke kūpaʻa me ka ʻole o ka hoʻokō ʻana i ka hana.
Ke ʻimi nei ka noiʻi noiʻi i nā ʻāpana crossbreed– ʻO nā ʻōhua kumu-ʻili me nā pūpū silica ma luna o nā cores magnetic a i ʻole plasmonic cores– no nā mea multifunctional i ka nānā ʻana a me ka wahi mālama mana.
I ka hopena, hōʻike ka silica poepoe i ke ʻano o ka mana morphological i ka micro- a hiki i ka nanoscale ke hoʻololi i kahi huahana maʻamau i mea hiki ke hana kiʻekiʻe ma waena o nā ʻenehana hou.
Mai ka pale ʻana i nā microchips i ka holomua ʻana i nā diagnostics olakino, kona hui 'oko'a o ke kino, kemika, a ke hoʻomau nei nā waiwai rheological i ka hoʻomohala ʻana i ka noiʻi ʻepekema a me ka ʻenekinia.
5. Mea hoʻolako
ʻO TRUNNANO kahi mea hoʻolako i ka tungsten disulfide me ka ʻoi aku 12 mau makahiki o ka ʻike i ka mālama ʻana i ka ikehu kūkulu nano a me ka hoʻomohala ʻana i ka nanotechnology. ʻAe ia i ka uku ma o Kāleka Kāleka, T/T, West Union a me Paypal. E hoʻouna aku ʻo Trunnano i nā waiwai i nā mea kūʻai aku ma waho ma o FedEx, DHL, ma ka lewa, a ma ke kai paha. Inā makemake ʻoe e ʻike hou aku e pili ana kinokika dioxide, eʻoluʻolu e leka uila iā mākou a hoʻouna i kahi nīnau([email protected]).
Nā huaʻōlelo: Silika pōʻai, silika dioxide, Silika
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