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1. Litšobotsi tsa Sebopeho le Tšebeliso ea Round Silika

1.1 Tlhaloso ea Morphological le Crystallinity


(Silika ea Spherical)

Silika e chitja e bolela silicon dioxide (SiO MABELI) likaroloana tse entsoeng ka seaparo se phahameng haholo, sebopeho se chitja se haufi le se phethahetseng, ho li khetholla ho tsoa ho liphofshoana tsa silika tse sa tloaelehang kapa tse thata tse nkiloeng mehloling eohle ea tlhaho.

Likotoana tsena li ka ba amorphous kapa crystalline, leha mofuta oa amorphous o laola lits'ebetso tsa khoebo ka lebaka la ts'ireletso ea eona ea pele ea lik'hemik'hale, mocheso o fokotsehileng oa sintering, le ho ba sieo ha li-phase shifts tse ka bakang microcracking.

Morpholoji e chitja ha e ea tloaeleha; e hloka ho phethoa ka mokhoa oa maiketsetso ka mekhoa e laoloang e laolang nucleation, kgolo, le phokotso ea matla holim'a libaka.

Ho fapana le quartz e pshatlehileng kapa silica e kopantsoeng, e bonts'ang mahlakore a makukuno le boholo bo pharalletseng bo potolohang, silika e chitja e na le libaka tse boreleli, botenya bo phahameng ba ho phutha, le liketso tsa isotropic tlas'a matšoenyeho a mochine, e etsa hore e be ntle bakeng sa lits'ebetso tse nepahetseng.

Boholo bo boholo bo fapana ho tloha ho 10s ea nanometers ho ea ho micrometer tse ngata, ka taolo e tiileng holim'a kabo ea boholo e etsang hore ho khonehe bakeng sa ts'ebetso e ka bonoang lits'ebetsong tse kopaneng.

1.2 Litsela tsa Synthesis tse laoloang

Mokhoa oa bohlokoa oa ho theha silika e chitja ke ts'ebetso ea Stöber, leano la sol-gel le entsoeng lilemong tsa bo-1960 le kenyelletsang hydrolysis le condensation ea silicon alkoxides.– hangata haholo ke tetraethyl orthosilicate (TEOS)– khethong ea joala e nang le ammonia joalo ka mokhanni.

Ka ho lokisa liparamente joalo ka maikutlo a reactant, karolo ea metsi ho alkoxide, pH, boemo ba mocheso, le nako ea ho arabela, bafuputsi ba ka khetha boholo ba sekhechana, monodispersity, le k'hemistri ea sebaka se ka holimo.

Mokhoa ona o fana ka mokhoa o tšoanang haholo, didikadikwe tse senang kgokahano tse nang le kgatiso e ntle haholo ya batch-to-batch, bohlokoa bakeng sa tlhahiso ea kajeno.

Mekhoa e fapaneng e kenyelletsa flame spheroidization, moo likhechana tsa silica tse sa leka-lekaneng li qhibilihang le ho ntlafatsoa ho ba lipotoloho ho sebelisoa plasma ea mocheso o phahameng kapa kalafo ea mollo., le maano a thehiloeng ho emulsion a lumellang encapsulation kapa core-shell structuring.

Bakeng sa tlhahiso e kholo ea khoebo, Ho sebelisoa litsela tsa pula tse thehiloeng ho sodium silicate, ho sebelisa scalability e bolokang chelete e ngata ha u ntse u boloka qitikoe e nepahetseng le bohloeki.

Ts'ebetso ea bokaholimo ho pholletsa kapa ka mor'a synthesis– joalo ka ho kenya disele– e ka hlahisa lihlopha tsa tlhaho (mohlala, amino, epoxy, kapa vinyl) ho matlafatsa tšebelisano le matrices a polymer kapa ho etsa hore ho khonehe bakeng sa bioconjugation.


( Silika ea Spherical)

2. Thepa ea Ts'ebetso le Melemo ea Sebetsa

2.1 Ho phalla, Loading Density, le Mekhoa ea Rheological

E 'ngoe ea melemo ea bohlokoa ka ho fetisisa ea silika e chitja ke ho phalla ha eona ho ikhethang ha ho bapisoa le li-angular., thepa ea bohlokoa ts'ebetsong ea phofo, ho bopa ka ente, le tlhahiso ea tlatsetso.

Ho ba sieo ha mecheso e bohale ho fokotsa ho phunya ha likaroloana, ho dumella tenya, pakela e homogeneous e nang le sebaka se senyane sa lefeela, e ntlafatsang botšepehi ba mechine le conductivity ea mocheso oa metsoako ea ho qetela.

Ka har'a sephutheloana sa digital, sepakapaka se phahameng se otlolohile se lekana le ho fokotsa litaba tsa resin ho li-encapsulants, ho matlafatsa tšireletso ea mocheso le ho fokotsa coefficient ea katoloso ea mocheso (CTE).

Ho feta moo, likotoana tse chitja li fana ka thepa e ntle ea bolulo ho li-suspension le li-pastes, ho fokotsa viscosity le ho thibela ho teteana ha moriri, e netefatsang ho fana ka boreleli le ho koaheloa ka mokhoa o ts'oanang ha ho etsoa li-semiconductor.

Litloaelo tsena tse laoloang tsa phallo li bohlokoa haholo lits'ebetsong tse joalo ka flip-chip underfill, moo ho hlokahalang boemo bo itseng ba lintho tse bonahalang le ho tlatsoa ntle ho letho.

2.2 Tšireletso ea Mechanical le Thermal

Spherical silica e bonts'a ho tiea ha mochini le modulus e tenyetsehang, ho eketsa tšehetso ea matrices a polymer ntle le ho hlahisa khatello ea maikutlo likhutlong tse bohale.

Ha e kopantsoe ka har'a li-epoxy resin kapa silicones, e ntlafatsa ho tiea, sebelisa khanyetso, le tshireletso ya dimensional tlas'a mocheso oa libaesekele.

Coefficient ea eona e tlase ea kholo ea mocheso (~ 0.5 × 10 ⁻⁶/ K) e ts'oana haholo le ea li-wafers tsa silicon le liboto tsa potoloho tse hatisitsoeng, ho fokotsa khatello ea ho se lekane ha mocheso ho lisebelisoa tsa microelectronic.

Ho feta moo, silika e pota-potileng e boloka botšepehi ba sebopeho maemong a phahameng a mocheso (hoo e ka bang ~ 1000 ° C maemong a sa tsitsang), ho etsa hore e tšoanelehe bakeng sa lits'ebetso tse ts'epahalang haholo sebakeng sa sefofane le lisebelisoa tsa elektroniki tsa likoloi.

Motsoako oa ts'ireletso ea mocheso le ho kenya motlakase ho ntlafatsa ts'ebeliso ea eona ho likarolo tsa matla le ho paka lihlahisoa tsa LED.

3. Likopo ho Lisebelisoa tsa Elektronike le Indasteri ea Semiconductor

3.1 Boikarabello ho Packaging ea Sehlahisoa sa Elektronike le Encapsulation

Spherical silica ke sehlahisoa sa motheo 'marakeng oa semiconductor, haholo-holo e sebelisoa e le ho tlatsa metsoako ea epoxy molding (Li-EMCs) bakeng sa chip encapsulation.

Ho nkela li-filler tse tloaelehileng tse sa leka-lekaneng ka tse chitja ho tsosolositse boqapi ba ho paka sehlahisoa ka ho nolofalletsa ho kenya li-filler tse kholo. (> 80 wt%), ho phalla ha hlobo ho ntlafetseng, le ho theola cable ho tsamaea nakong eohle ea phetiso.

Tsoelo-pele ena e ts'ehetsa miniaturization ea lipotoloho tse kenyellelitsoeng le kholo ea meralo e tsoetseng pele joalo ka sistimi ka har'a sephutheloana. (SiP) le sephutheloana sa lihlahisoa tsa fan-out wafer-level (FOWLP).

Sebaka se boreleli sa likaroloana tse chitja se boetse se fokotsa ho hohoa ha mehala ea khauta e ntle kapa ea koporo., ho ntlafatsa boleng ba sesebelisoa le ho khutlisa.

Ho feta moo, tlhaho ea bona ea isotropic e etsa hore ho be le phepelo e tšoanang ea khatello ea maikutlo, ho fokotsa kotsi ea delamination le fracturing nakong ea ho palama libaesekele tse futhumetseng.

3.2 Sebelisa Mekhoeng ea ho Pholisa le ea Planarization

Ho planarization ea lik'hemik'hale tsa lik'hemik'hale (CMP), silika nanoparticles e pota-potileng e sebetsa e le baemeli ba hlabang ka har'a li-slurries tse entsoeng ho bentša liphaphatha tsa silicon, lilense tsa optical, le mecha ea phatlalatso ea sebaka sa polokelo ea makenete.

Libopeho le boholo ba tsona tse ts'oanang li netefatsa litekanyetso tse tloaelehileng tsa ho felisa lihlahisoa le mefokolo e fokolang ea sebaka se kang mengoapo kapa likoting..

Silika e chitja e fetotsoeng ka holim'a metsi e ka hlophisoa bakeng sa lintlha tsa tikoloho ea pH le kutlo, ho matlafatsa khetho pakeng tsa lisebelisoa tse fapaneng sebakeng sa wafer.

Ho nepahala hona ho thusa ho etsa meaho ea semiconductor ea multilayered e nang le botenya ba nanometer-scale., tlhokahalo bakeng sa boithuto bo bocha ba lithography le assimitation ea lisebelisoa.

4. Likopo tse hlahang le tse fapaneng tsa Taeo

4.1 Biomedical le Diagnostic Ho Sebelisa

Ho feta lisebelisoa tsa elektroniki, li-round silica nanoparticles li sebelisoa haholo ho biomedicine ka lebaka la ho lumellana ha tsona, boiketlo ba tshebetso, le tunable porosity.

Ba sebetsa e le bafani ba phano ea meriana, moo lisebelisoa tsa tsosoloso li tlatsitsoeng ka har'a meaho ea mesoporous le ho qalisoa ka lebaka la tšusumetso e kang pH kapa li-enzyme..

Litlhahlobong, li-silica spheres tse khethiloeng ka fluorescent li sebetsa e le tse tsitsitseng, lisebelisoa tse se nang chefo bakeng sa ho nka litšoantšo le ho hlahloba lintho tse phelang, ho feta matheba a quantum maemong a itseng a tlhaho.

Bokaholimo ba tsona bo ka kopanngoa le li-antibodies, li-peptide, kapa DNA bakeng sa tlhahlobo e lebisitsoeng ea likokoana-hloko kapa li-biomarker tsa mofetše.

4.2 Tlhahiso e Ekelitsoeng le Lihlahisoa tse Kopanetsoeng

Ka khatiso ea 3D, ka ho khetheha ho jetting ea binder le stereolithography, liphofo tsa silika tse chitja li ntlafatsa boleng ba bethe ea phofo le kutloano ea lera, tlisa qeto e phahameng le matla a mochini ho li-porcelain tse hatisitsoeng.

E le mohato o ntlafatsang ka har'a matrix a tšepe le likarolo tsa polymer matrix, e ntlafatsa ho tsitsa, tlhokomelo ea mocheso, le ho apara ho hanyetsa ntle le ho senya ts'ebetso.

Boithuto ba lipatlisiso le bona bo ntse bo hlahloba likaroloana tsa mefuta e fapaneng– meaho ea likhetla tsa mantlha tse nang le likhetla tsa silika holim'a li-cores tsa makenete kapa tsa plasmonic– bakeng sa lisebelisoa tse ngata tse sebetsang sebakeng sa ho hlokomela le ho boloka matla.

Ha re phethela, silika e pota-potileng e bonts'a taolo ea morphological joang ho micro- le nanoscale e ka fetola sehlahisoa se tloaelehileng hore e be sesebelisoa se sebetsang hantle ho pholletsa le mefuta e fapaneng ea theknoloji ea sejoale-joale..

Ho tloha ho sireletsa li-microchips ho ea ho nts'etsopele ea tlhahlobo ea bongaka, motsoako oa eona o ikhethang oa 'mele, khemikhale, le thepa ea rheological e tsoela pele ho khanna tsoelo-pele lipatlisisong tsa saense le boenjiniere.

5. Mofani

TRUNNANO ke morekisi oa tungsten disulfide e nang le over 12 lilemo tsa boiphihlelo ba ho boloka matla a nano-building le nts'etsopele ea nanotechnology. E amohela tefo ka Credit Card, T/T, West Union le Paypal. Trunnano e tla romella thepa ho bareki ba mose ho maoatle ka FedEx, DHL, ka moea, kapa ka lewatle. Haeba u batla ho tseba haholoanyane ka silicon dioxide ea tlhaho, ka kopo ikutloe u lokolohile ho ikopanya le rona le ho romela potso([email protected]).
Li-tag: Silika ea Spherical, silicon dioxide, Silika

Lingoliloeng tsohle le litšoantšo li tsoa Marang-rang. Haeba ho na le litaba tsa copyright, ka kopo ikopanye le rona ka nako ho hlakola.

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