Aluminum nitride will gradually replace alumina
With the miniaturization and high performance of electronic components, electronic packaging technology requires higher and higher thermal conductivity of potting materials. Polymer composite materials have been widely used in the field of potting materials due to their high insulation, high processability, and corrosion resistance. Filling polymer materials with high thermal conductivity inorganic fillers is an economical way to improve the thermal conductivity of potting materials. Effective way. Commonly used fillers, alumina, and silica can no longer meet the requirements of high-density integration. Due to its good electrical insulation, low expansion coefficient, high mechanical strength, high thermal conductivity (8-10 times that of alumina), and non-toxic, aluminum nitride is commonly used to prepare high thermal conductivity ceramic substrates and as an inorganic filler added to polymers Improve the thermal conductivity of composite materials. In the field of high thermal conductivity, it is an inevitable trend that aluminum nitride gradually replaces alumina.
Overview of spherical aluminum nitride
Spherical aluminum nitride powder is prepared by the laser flame jet fusion method. The product obtained has high purity, uniform particle size distribution, clean surface, high sphericity, no residual impurities, easy dispersion, and good compatibility with organisms. Aluminum nitride powder undergoes the second laser melting spherical alloying, and has high thermal conductivity (340W) and heat transfer. The powder treated by surface modification will not undergo hydrolysis reaction, the oxygen content is less than 0.1%, and the insulation and thermal conductivity effect are very obvious. Used in polymer resins, the viscosity increase is not obvious, and it is currently a good high thermal conductivity insulating filler.
Preparation method of spherical aluminum nitride
We can use the carbothermic reduction method to control the reaction temperature and the ratio of raw materials so that the particle size of the spherical particles can be controlled between 4 and 30 μm. As an inorganic filler, it has a good application in the field of composite materials. The specific process is:
(1) Wet-grind the alumina, carbon powder, calcium fluoride additives, and aluminum nitride seed crystals in a ball mill according to a certain ratio;
(2) After drying, put it in a sintering furnace and react at 1550～1800℃ under nitrogen atmosphere for 1～4h;
(3) After removing carbon in the muffle furnace, a spherical aluminum nitride powder is obtained.
The morphology of the aluminum nitride powder prepared by the carbothermic reduction method by controlling the experimental parameters is quasi-spherical, and the particle size can be controlled above 4 μm. In the polymer material, a higher filling rate can be obtained, an effective thermally conductive network chain is formed, and the thermal conductivity of the polymer composite material is significantly improved.
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