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HomeNewsAsiaThe Main Characteristics of Silicon Nitride |

The Main Characteristics of Silicon Nitride |

Silicon Nitride application:

Silicon nitride has many uses and is an essential engineering ceramic. Each form of silicon nitride has its own unique properties. Silicium nitride is very strong at high temperatures and exhibits exceptional mechanical properties such as low density, excellent flexural strength and high fracture toughness. The material is strong and extremely tough. This material has exceptional thermal properties. It can tolerate rapid temperature change and thermal shock. The chemical stability of silicon nitride is excellent, with it being resistant to acidic and alkalis as well as corrosive gases and liquid metals.

Principal Characteristics Of Silicon Nitride

Silicium nitride has exceptional mechanical and thermal properties. This makes it suitable for high-end industrial applications. A material’s thermal conductivity refers to its inherent capacity to conduct or transfer heat. It is the key factor that determines whether engineering materials are suitable for extreme temperatures. Silicon nitride, due to its unique chemical and microstructure compositions, has a low thermal conductivity in comparison to other metals.


Due to the strength of its atomic bonds at room temperatures, silicon nitride exhibits excellent stability. It is highly resistant and stable to acidic and alkaline solution corrosion. When considering the long-term implant of silicon nitride in the body, in both salty and wet environments, this is vital. It is the oxide layer that forms on the material’s exterior which gives rise to corrosion resistance. When silicon nitride was exposed to hot gases and molten salts and in metals and other complex conditions, the same resistance was seen. It is the core of corrosion resistance.


Because of its excellent microstructure, high strength, toughness and other outstanding properties, silicon Nitride has been a highly-attractive structural component for many different industries.


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