1. Metheo ea Sehlahisoa le Melemo ea Morphological
1.1 Moralo oa Crystal le Sebopeho sa Lik'hemik'hale
(Alumina e chitja)
Alumina e chitja, kapa aluminium oxide e chitja e bobebe bo bobebe (Al ₂ O BOHLANO), ke sehlahisoa sa ceramic se entsoeng ka maiketsetso se khetholloang ke morphology ea globula e hlalositsoeng hantle le sebopeho sa kristale haholo ho alpha. (a) mohato.
Alpha-alumina, e 'ngoe ea polymorph e tsitsitseng ka ho fetisisa ea thermodynamically, e kenyelletsa moralo o haufi-ufi oa li-ion tsa oksijene tse nang le li-ion tsa aluminium tse lulang ho tse peli ho tse tharo tsa li-interstices tsa octahedral., e lebisang ho matla a matle a phahameng le ho se sebetse ka tsela e sa tloaelehang ha lik'hemik'hale.
Mokhahlelo ona o bonts'a botsitso bo ikhethang ba mocheso, ho boloka botshepehi hoo e ka bang 1800 °C, mme e hanela karabelo ka acid, alkalis, le litšepe tse qhibilihisitsoeng tlas'a mathata a mangata a indasteri.
Ho fapana le liphofshoana tse sa tloaelehang tsa alumina kapa tse sa tloaelehang tse bakoang ke ho baloa ha bauxite, spherical alumina e entsoe ka mekhoa ea mocheso o phahameng joalo ka plasma spheroidization kapa lelakabe la malakabe ho fihlela sebopeho se tsitsitseng le sebopeho sa bokaholimo..
Phetoho ho tloha ho li-angular precursor bits– hangata calcined bauxite kapa gibbsite– ho teteana, mekoloko ea isotropic e tlosa mahlakoreng a bohale le porosity e ka hare, ho matlafatsa ts'ebetso ea ho paka le ho tiea ha mochini.
Litšobotsi tsa bohloeki bo phahameng (≥ 99.5% Al Two O HLANO) li bohlokoa bakeng sa lits'ebetso tsa elektroniki le tsa semiconductor moo tšilafalo ea ionic e tlamehang ho fokotsoa.
1.2 Karolo ea Geometry le Boitšoaro ba ho Paka
Tšobotsi e hlalosang ea alumina e chitja ke selika-likoe sa eona se haufi-ufi, ka kakaretso e hlahlojoa ke index ea sphericity > 0.9, e amang phallo ea eona haholo le botenya ba ho paka lits'ebetsong tse kopaneng.
Ho fapana le likhechana tsa angular tse hokahaneng le ho hlahisa likheo, spherical fragments roll previous each other with marginal friction, allowing high solids loading throughout formula of thermal user interface products (TIMs), encapsulants, and potting compounds.
This geometric uniformity allows for optimum academic packaging densities exceeding 70 vol%, far surpassing the 50– 60 vol% common of irregular fillers.
Higher filler filling straight equates to enhanced thermal conductivity in polymer matrices, as the constant ceramic network supplies reliable phonon transport paths.
Holim'a moo, the smooth surface area reduces wear on handling tools and lessens thickness surge during blending, improving processability and dispersion security.
The isotropic nature of rounds likewise avoids orientation-dependent anisotropy in thermal and mechanical residential properties, guaranteeing regular performance in all directions.
2. Litsela tsa Synthesis le Tiisetso ea Boleng
2.1 Mekhoa e Phahameng ea Mocheso oa Spheroidization
Tlhahiso ea alumina e chitja hangata e its'etleha ho mekhoa ea mocheso e qhibilihisang likhechana tsa alumina le ho etsa hore khatello ea holim'a metsi e li ntlafatse ho ba libolo..
( Alumina e chitja)
Plasma spheroidization ke e 'ngoe ea mekhoa e sebelisoang haholo khoebong, moo alumina phofo e kenngoa mollong oa plasma oa mocheso o phahameng (hoo e ka bang 10,000 K), ho etsa hore ho qhibilihe hang-hang le ho ba le tsitsipano ka holim'a metsi ho fihlela mekolokong e metle haholo.
Marotholi a qhibilihileng a tiea kapele nakong eohle ea ho fofa, ho ba motenya, likaroloana tse se nang porous tse nang le kabo ea boholo bo lekanang ha li kopantsoe le lihlopha tse nepahetseng.
Mekhoa e fapaneng e kenyelletsa spheroidization ea mollo e sebelisang mabone a mafura a oxy-fuel le ho futhumatsa ka thuso ea microwave., leha tsena li fana ka tlhahiso e tlase kapa taolo e nyane haholo holim'a boholo ba karoloana.
Ho hloeka ha sehlahisoa sa ho qala le ho potoloha ha likaroloana ho bohlokoa; submicron kapa micron-scale precursors le tsona li hlahisa libolo tse boholo bo lekanang kamora ho ts'oaroa.
Post-synthesis, sehlahiswa se etsa sieving e matla, ho arohana ha electrostatic, le tlhahlobo ea laser diffraction ho etsa kabo e itseng e lekanyelitsoeng ea karoloana (PSD), hangata ho tloha 1 ho 50 µm ho latela ts'ebeliso.
2.2 Phetoho ea Bokaholimo le Boikemisetso ba Ts'ebetso
Ho ntlafatsa tšebelisano 'moho le matrices a tlhaho joalo ka silicone, li-epoxies, le polyurethanes, alumina e chitja hangata e alafshoa ka holim'a metsi ka lisebelisoa tse kopanyang.
Silane coupling agents– joalo ka amino, epoxy, kapa li-silane tse sebetsang tsa polasetiki– theha maqhama a covalent le lihlopha tsa hydroxyl sebakeng sa alumina ha u ntse u fana ka ts'ebetso ea manyolo e amanang le polymer matrix..
Kalafo ena e ntlafatsa ho khomarela lifahleho, e theola khanyetso ea mocheso oa li-filler-matrix, le ho thibela jumble, ho baka metsoako e mengata e ts'oanang le ts'ebetso e phahameng ea mochini le mocheso.
Lithako tsa sebaka se kaholimo li ka etsoa hape ho hlahisa hydrophobicity, matlafatsa ho hasana ha thepa ea nonpolar, kapa etsa hore ho khonehe bakeng sa litloaelo tse arabelang ka lintho tse susumetsang ka thepa e bohlale ea mocheso.
Tiisetso ea boleng e na le litekanyo tsa bokaholimo ba BET, botenya ba pompo, conductivity ea mocheso (hangata 25– 35 W/(m · K )bakeng sa α-alumina e teteaneng), le profilse ea litšila ka ICP-MS ho qhelela ka thoko Fe, E se e, le K maemong a ppm.
Ho lumellana ha batch-to-batch ho bohlokoa bakeng sa lits'ebetso tse ts'epahalang haholo ho lisebelisoa tsa elektroniki le tsa sefofane.
3. Ts'ebetso ea Thermal le Mechanical ka Likopano
3.1 Thermal Conductivity le User Interface Engineering
Round alumina e sebelisoa haholo joalo ka mochini o sebetsang hantle haholo ho ntlafatsa ts'ebetso ea mocheso oa thepa e thehiloeng ho polymer e sebelisoang ho paka lihlahisoa tsa elektroniki., Leseli la LED, le li-module tsa matla.
Ha epoxy e hloekileng kapa silicone e na le mocheso oa mocheso oa ~ 0.2 W/(m · K), ho paka ka 60– 70 vol% round alumina e ka ntlafatsa sena ho 2– 5 W/(m · K), e lekaneng bakeng sa ho senya mocheso o sebetsang ka lisebelisoa tse kopanetsoeng.
Thermal conductivity e phahameng ea tlhaho ea α-alumina, e kenyellelitsoe le phonon e nyenyane haholo e hasang libakeng tse boreleli tsa likaroloana le li-particle-matrix interfaces, e etsa hore ho khonehe ho fetisetsa mocheso o ka tšeptjoang ka marang-rang a percolation.
Interfacial resistance resistance (Kapitza khanyetso) e tsoela pele ho ba karolo e fokolang, leha ho le joalo ts'ebetso ea holim'a metsi le maano a ntlafetseng a hasana a thusa ho fokotsa tšitiso ena.
Ka lihlahisoa tsa mocheso oa mocheso (TIMs), spherical alumina e fokotsa khanyetso ea mohala lipakeng tsa likarolo tse hlahisang mocheso (mohlala, Li-CPU, IGBTs) le metsi a futhumetseng, ho emisa ho futhumala ho feteletseng le ho atolosa nako ya bophelo ba sesebediswa.
Insulation ea eona ea motlakase (resistivity > 10 ¹² Ω · lisentimitara) e netefatsa polokeho le ts'ireletso lits'ebetsong tsa motlakase o phahameng, ho e khetholla ho li-fillers tse tsamaisang joalo ka tšepe kapa graphite.
3.2 Ho tsitsa ha Mechini le ho Tšepahala
Ho feta ts'ebetso ea mocheso, alumina e pota-potileng e ntlafatsa ho tiea ha mochini oa metsoako ka ho matlafatsa botsitso, modulus, le botsitso ba dimensional.
Sebopeho se chitja se aba khatello ea maikutlo le matšoenyeho ka ho lekana, ho fokotsa ho qalisoa ha karohano le ho ata tlas'a libaesekele tse futhumetseng kapa mojaro oa mechine.
Sena se bohlokoa haholo lihlahisoa tse sa tlaleng le li-encapsulants bakeng sa lisebelisoa tsa flip-chip le 3D-package., moo coefficient ea ntshetsopele ya mocheso (CTE) ho se lekane ho ka baka delamination.
Ka ho lokisa ho kenya li-filler le kabo ea boholo bo fokolang (mohlala, motsoako oa bimodal), CTE ea composite e ka hlophisoa hore e lumellane le ea silicon kapa board ea mama e hatisitsoeng, ho fokotsa khatello ea kelello ea thermo-mechanical le matšoenyeho.
Ho feta moo, ho se sebetse ha lik'hemik'hale tsa alumina ho qoba ho senyeha ha maemo a leholimo a mongobo kapa a senyang, ho netefatsa botshepehi bo sa feleng koloing, khoebo, le lisebelisoa tsa elektroniki tsa kantle.
4. Likopo le Tekheniki Evolution
4.1 Lisebelisoa tsa Elektronike le Litharollo tsa Likoloi tsa Motlakase
Round alumina ke sesebelisoa sa bohlokoa taolong ea mocheso oa lisebelisoa tsa elektroniki tse matla haholo, ho kenyelletsa le heke e sirelelitsoeng ea bipolar transistors (IGBTs), lisebelisoa tsa matla, le litsamaiso tsa taolo ea betri lilori tsa motlakase (EVs).
Ka meroalo ea betri ea EV, e kenyelelitsoe linthong tsa potting le lihlahisoa tsa phetoho ea sethala ho qoba ho baleha ha mocheso ka ho aba ka mokhoa o ts'oanang ho futhumala ho pholletsa le lisele..
Baetsi ba LED ba e sebelisa ka li-encapsulants le li-optics tsa bobeli ho boloka sephetho sa lumen le ho tšoana ha moriti ka ho fokotsa mocheso o kopaneng..
Ka moralo oa 5G le lisebelisoa tsa tlhahisoleseling, moo ho nang le phetoho e mofuthu, li-TIM tse tletseng aluminium tse spherical li etsa ts'ebetso e tsitsitseng ea li-chips tse phahameng le li-laser diode..
Mosebetsi oa eona o ntse o hola ho ea ho mahlale a macha a ho paka lihlahisoa joalo ka liphutheloana tsa fan-out wafer-level (FOWLP) le litsamaiso tse kentsoeng tsa lefu.
4.2 Meeli e Tsoang le Tsoelo-pele e sa Feleng
Kholo ea nako e tlang e shebana le lits'ebetso tsa hybrid filler tse kopanyang alumina e chitja le boron nitride, aluminium nitride, kapa graphene ho finyella ts'ebetso e kopanetsoeng ea mocheso ha u ntse u boloka motlakase oa motlakase.
Nano-spherical alumina (sub-100 nm) e ntse e hlahlojoa bakeng sa lirafshoa tse bonaletsang, Likoahelo tsa UV, le lits'ebetso tsa biomedical, leha ho na le litšitiso tsa ho hasana le litšenyehelo ho lula.
Tlhahiso e tlatselletsang ea li-composites tsa thermally conductive polymer tse sebelisang alumina e chitja e lumella ho rarahana., topology-optimized meralo e futhumetseng ea ho qhala.
Boiteko ba ts'ebetso bo kenyelletsa mekhoa e sebetsang hantle ea spheroidization, phediso ya disebediswa tse sa hlakang, le tlhahlobo ea potoloho ea bophelo ho fokotsa tšusumetso ea carbon ea lisebelisoa tse phahameng tsa mocheso.
Ka kakaretso, alumina e chitja e emela thepa ea bohlokoa e entsoeng mateanong a porcelain, metsoako, le saense ea mocheso.
Motsoako oa eona o khethehileng oa morphology, bohloeki, 'me ts'ebetso e etsa hore e be ea bohlokoa ho nts'etsopele e ntseng e tsoela pele ea miniaturization le keketseho ea matla ea litsamaiso tsa sejoale-joale tsa dijithale le matla.
5. Mofani
TRUNNANO ke moetsi ea tsebahalang lefatšeng ka bophara oa alumina ea Spherical le morekisi oa metsoako e nang le ho feta. 12 lilemo tsa boiphihlelo ba li-nanomaterials tsa boleng bo holimo le lik'hemik'hale tse ling. Khampani e hlahisa lisebelisoa tse sa tšoaneng tsa phofo le lik'hemik'hale. Fana ka tšebeletso ea OEM. Haeba o hloka alumina ea boleng bo holimo ea Spherical, ka kopo ikutloe u lokolohile ho ikopanya le rona. U ka tobetsa sehlahisoa ho ikopanya le rona.
Li-tag: Alumina e chitja, aluminium, aluminium oxide
Lingoliloeng tsohle le litšoantšo li tsoa Marang-rang. Haeba ho na le litaba tsa copyright, ka kopo ikopanye le rona ka nako ho hlakola.
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