Alumina Ceramic Substrates: ʻO nā mea hoʻonā kumu o ka hoʻopili uila uila kiʻekiʻe a me ka hoʻohui ʻana o Microsystem i ka ʻenehana hou alumina al2o3

1. Nā Kuleana Mea Pono a me nā Kūlana Kūlana o Alumina Ceramics

1.1 Crystallographic a me Compositional kumu o α-Alumina

(Alumina Ceramic Substrates)

ʻO nā substratum seramika alumina, ʻo ka hapa nui i hana ʻia me ka alumini oxide māmā (Al ₂ O ₃), e hana ma ke ʻano he iwi kuamoʻo o ka ʻeke huahana uila hou ma muli o kā lākou equilibrium phenomenal o ka insulation uila., paʻa wela, ikaika mechanical, a me ka manufacturability.

ʻO ka ʻaoʻao thermodynamically paʻa loa o ka alumina i ka wela he corundum, a i ʻole α-Al ʻElua O ʻElua, e hoʻoheheʻe ʻia i loko o kahi latticework oxygen piha piha hexagonal me nā ion alumini e noho ana i ʻelua hapakolu o nā pūnaewele interstitial octahedral..

Hāʻawi kēia papahana atomika mānoanoa i ka paʻakikī kiʻekiʻe (Mohs 9), kūʻē maikaʻi loa, a me ka inertness kemika paʻa, e hana i ka α-alumina i kūpono no nā kaiapuni hana ʻino.

Loaʻa i nā substratum pāʻoihana he 90– 99.8% Al ₂ O EHA, me nā mea hoʻohui liʻiliʻi o ka silica (SiO ELUA), magnesia (MgO), a i ʻole nā ​​oxides honua maʻamau i hoʻohana ʻia ma ke ʻano he mea hoʻoheheʻe ʻia e hoʻolaha i ka densification a mālama i ka ulu ʻana o ka palaoa i ka wā o ka mālama ʻana i ka wela..

ʻOi aku ka maikaʻi o ka maʻemaʻe (e.g., 99.5% a oi aku) hōʻike i ke kūpaʻa uila a me ka conductivity thermal, ʻoiai nā ʻano like ʻole o ka maʻemaʻe haʻahaʻa (90– 96%) hāʻawi i nā hāʻina kūpono no nā noi liʻiliʻi.

1.2 Microstructure a me Defect Design no ka Pono Elele

Hoʻokumu koʻikoʻi ka maikaʻi o nā substrates alumina i nā ʻōnaehana kikohoʻe ma luna o ka microstructural harmony a me ka hōʻemi ʻana i nā pilikia.

He uku, equiaxed grain structure– maʻa mau mai 1 i 10 micrometers– hana i kekahi mau mīkini paʻa a hoʻohaʻahaʻa i ka hiki ke hoʻohua ʻia ma lalo o ka pilikia wela a i ʻole mechanical.

Porosity, ʻoi aku ka pili ʻana a i ʻole nā ​​pores pili i luna, Pono e hoʻemi ʻia no ka mea e hoʻohaʻahaʻa i ka paʻakikī mechanical a me ka hana dielectric.

ʻO nā hoʻolālā hana kiʻekiʻe e like me ka hoʻolaha lipine, kaomi isostatic, a me ka hoʻoponopono ʻia ʻana o ka sintering i ka ea a i ʻole nā ​​​​kaiapuni i mālama ʻia e hiki ai ke hana i nā substrates me ka mānoanoa kokoke-theoretical. (> 99.5%) a me ka ʻeleʻele o ka ʻili ma lalo 0.5 µm, koʻikoʻi no ka metallization kiʻiʻoniʻoni lahilahi a me ka hoʻopaʻa ʻana i ke kaula.

Eia hou, ʻO ka hoʻokaʻawale ʻana i ka haumia ma nā palena ʻai hiki ke hopena i nā kahawai leak a i ʻole ka neʻe ʻana o ka electrochemical ma lalo o ka manaʻo ʻino., e koi ana i ka mana koʻikoʻi ma luna o ka maʻemaʻe o nā mea maka a me nā pilikia sintering e hana i kekahi kūpaʻa lōʻihi i loko o nā kaiapuni mākū a kiʻekiʻe-voltage..

2. Nā Kaʻina Hana Hana a me nā ʻenehana kūkulu substratum

( Alumina Ceramic Substrates)

2.1 ʻO ka hoʻolaha ʻana i ka lipine a me ka hoʻoponopono kino kino

Hoʻomaka ka hana ʻana i nā substrate seramika alumina me ka hana hoʻomākaukau o kahi slurry puʻupuʻu loa i loaʻa ka submicron Al ₂ O ʻekolu pauka., mea hoʻopaʻa kino, plasticizers, nā mea hoʻopuehu, a me nā mea hoʻoheheʻe.

Hana ʻia kēia slurry ma o ka hoʻolaha ʻana i ka lipine– He ala hoʻomau kahi e hoʻokuʻu ʻia ai ka hoʻokuʻu ʻana i kahi kiʻiʻoniʻoni hoʻoneʻe e hoʻohana ana i kahi lāʻau lapaʻau pololei e loaʻa ai ka mānoanoa like., maʻamau ma waena 0.1 mm a 1.0 mm.

Ma hope o ka hemo ʻana o ka solvent, ka hopena “lipine pili kaiaola” hiki ke kuʻi, wili ʻia, a i ʻole i ʻoki ʻia i ka laser e hana ʻia ma o nā puka no nā pilina pololei.

Hiki ke laminated ʻia nā papa he nui e hana i nā substrate multilayer no ka assimilation kaapuni paʻakikī, ʻoiai ʻo ka hapa nui o nā noi pāʻoihana e hoʻohana i nā hoʻonohonoho hoʻokahi-layer ma muli o ka hoʻihoʻi ʻana iā ʻoe a me nā noʻonoʻo hoʻomohala wela.

Hoʻopili ʻia nā lipine pili i ke kaiapuni e hoʻopau i nā mea hoʻohui organik me ka hoʻokaʻawale ʻana i ka wela ma mua o ka sintering hope..

2.2 Sintering a me Metallization no ka hui kaapuni

Hana ʻia ka sintering i ka ea ma nā mahana ma waena 1550 ° C a 1650 ° C, kahi e hoʻokuʻu ʻia ai ka hoʻoheheʻe ʻana i ka pore a me ka coarsening palaoa e hoʻokō i ka densification piha.

ʻO ka hōʻemi pololei i ka wā o ka sintering– maʻamau 15– 20%– pono e wānana pololei ʻia a hana ʻia no ke ʻano o nā lipine pili i ka honua e hana i kahi kikoʻī kikoʻī o ka substratum hope..

Ka hoʻokō ʻana me ka sintering, Hoʻokomo ʻia ka metallization ma luna o ka hana conductive traces, pads, a me nā vias.

2 ʻo nā ʻenehana kī nui: paʻi kiʻiʻoniʻoni mānoanoa a me ka waiho ʻana i nā kiʻiʻoniʻoni lahilahi.

I ka manoanoa-kiʻiʻoniʻoni hou, nā pāpaʻi me nā pauka kila (e.g., tungsten, molybdenum, a i ʻole nā ​​ʻāpana kala-palladium) paʻi ʻia ka pale ma luna o ka substratum a puhi pū ʻia i kahi ʻano hoʻohaʻahaʻa e hoʻomohala i ka lōʻihi, kiʻekiʻe-adhesion conductors.

No nā noi kiʻekiʻe a i ʻole kiʻekiʻe-frequency, Hoʻohana ʻia nā kaʻina hana kiʻiʻoniʻoni e like me ka sputtering a i ʻole dissipation e hoʻohaʻahaʻa i nā papa hoʻopaʻa uku (e.g., titanium a i ʻole chromium) i hoʻokō ʻia e ke keleawe a i ʻole ke gula, hiki i ke ʻano sub-micron ma o ka photolithography.

Ua piha ʻo Vias i nā pastes conductive a puhi ʻia e hoʻomohala i nā pilina uila ma waena o nā papa i nā ʻano multilayer.

3. Nā Koʻikoʻi Hana a me nā Metric Efficiency ma nā lako uila

3.1 ʻO nā maʻamau wela a me ka uila ma lalo o ka hana hoʻoikaika kino

Manaʻo ʻia nā substrate alumina no kā lākou hui pono ʻana o ka conductivity thermal haʻahaʻa (20– 35 W/m · K no 96– 99.8% Al ₂ O EKOLU), ka mea e hiki ai ke hoʻoheheʻe ʻia mehana mai nā mea hana mana, a me ka nui resistivity (> 10 ¹⁴ Ω · kenimika), e hōʻoia ana i ke au leak marginal.

ʻO kā lākou dielectric mau (εᵣ ≈ 9– 10 ma 1 MHz) paʻa ma luna o kahi ākea ākea a me nā ʻano maʻamau, kūpono ia no nā kaapuni alapine kiʻekiʻe a hiki i nā ghz he nui, ʻoiai ua koho ʻia nā mea haʻahaʻa-κ e like me ka nitride alumini māmā māmā no nā noi hawewe mm.

ʻO ke koena o ka hoʻomohala wela (CTE) o ka alumina (~ 6.8– 7.2 ppm/K) ua kūpono maikaʻi ʻia me ka silika (~ 3 ppm/K) a me kekahi mau mea hoʻopili pahu, ka hoʻohaʻahaʻa ʻana i ka haʻalulu thermo-mechanical i ka wā o ka hana gadget a me ka paikikala wela.

Eia naʻe, ʻO ka CTE mismatch me ka silika noho pilikia ma ka flip-chip a me ka hoʻonohonoho pono make-attach, ke kāhea maʻamau i nā mea hoʻopili kūpono a i ʻole nā ​​​​huahana underfill e hōʻemi i ka pau ʻole o ka luhi.

3.2 Ka Pono Mechanical a me ke Kaiapuni

Me ka mīkini, Hōʻike nā substratum alumina i ka ikaika flexural kiʻekiʻe (300– 400 MPa) a me ke kūpaʻa o ka dimensional maikaʻi loa ma lalo o nā hailona, e ʻae ana i kā lākou hoʻohana ʻana i nā mea uila uila no ka aerospace, kaʻa kaʻa, a me nā ʻōnaehana hoʻomalu pāʻoihana.

Paʻa lākou i ka haʻalulu, haʻalulu, a kolo i nā wela kiʻekiʻe, ka mālama ʻana i ke kūpaʻa o ka hale e like me ka nui 1500 ° C i loko o nā ʻano inert.

I loko o nā lewa hau, ʻO ka alumina maʻemaʻe kiʻekiʻe e hōʻike i ka liʻiliʻi o ka pulu ʻana a me ke kūpaʻa kūʻokoʻa i ka neʻe ʻana o ka ion, ka hana ʻana i kekahi mau pono lōʻihi ma waho a me nā noi haʻahaʻa kiʻekiʻe.

Hoʻopaʻa pū ka paʻa o ka ʻili me nā pōʻino mechanical i ka wā o ka lawelawe ʻana a me ka hui ʻana, ʻoiai pono e mālama ʻia i mea e pale ai i ka ʻoki ʻana o ka lihi ma muli o ka palupalu kumu.

4. Nā Hana Hana Hana a me ka Hoʻoikaika ʻenehana ma nā ʻāpana āpau

4.1 Mea uila uila, RF Modules, a me na lako kaa

Loaʻa nā substrate seramika alumina i nā ʻāpana uila mana, ʻo ia nā transistors bipolar puka insulated (Nā IGBT), MOSFET, a me nā mea hoʻoponopono, kahi e hāʻawi ai lākou i ka hoʻokaʻawale uila i ka wā e hāpai ana i ka hoʻololi ʻana i ka wela i nā pumehana.

Ma ka lekiō (RF) a me nā pōʻai microwave, hana lākou ma ke ʻano he ʻōnaehana lawelawe no nā kaapuni hoʻohui hybrid (HICs), ʻili o ka ʻili hawewe acoustic (SAW) nā kānana, a me nā ʻupena hānai antenna ma muli o ko lākou mau home dielectric paʻa a me ka hoʻemi ʻana i nā tangent poho.

Ma ka mākeke kaʻa, Hoʻohana ʻia nā substratum alumina i nā mea hoʻokele engine (Nā ECU), nā hoʻolālā sensor, a me ka ukana uila (EV) nā mea hoʻololi mana, kahi e pale ai i ka wela, kaʻa uila wela, a me ka ʻike pololei ʻana i nā wai hoʻopōʻino.

ʻO ko lākou hilinaʻi ʻana ma lalo o nā pilikia koʻikoʻi he mea nui ia no nā ʻōnaehana koʻikoʻi palekana e like me ka anti-lock braking (OPU OPU) a me nā ʻōnaehana kōkua hoʻokele holomua (ADAS).

4.2 Na Mea Lapaau, Aerospace, a me nā mea hoʻoponopono Micro-Electro-Mechanical

Ma waho aʻe o nā mea kūʻai aku a me nā uila uila, Hoʻohana ʻia nā substratum alumina i nā mea lapaʻau implantable e like me nā pacemakers a me nā neurostimulators, kahi e koʻikoʻi ai ka hermetic sealing a me ka biocompatibility.

I ka aerospace a me ka pale, Hoʻohana ʻia lākou i nā avionics, ʻōnaehana radar, a me nā modula pili ukali ma muli o ko lākou pale ʻana i ka radiation a me ka paʻa i nā hoʻonohonoho hoʻomaʻemaʻe vacuum.

Eia kekahi, Hoʻohana nui ʻia ka alumina ma ke ʻano he ʻōnaehana hoʻolālā a pale i nā ʻōnaehana micro-electro-mechanical (MEMS), ʻo ia hoʻi nā mea ʻike kaomi, nā mea hoʻokiʻekiʻe, a me nā mea hana microfluidic, kahi e pōmaikaʻi ai kona inertness kemika a me ka hoʻokō ʻana me ka lawelawe ʻana i nā kiʻiʻoniʻoni lahilahi.

Ke noho nei nā ʻōnaehana kikohoʻe e koi i ka mānoanoa o ka mana, hana liʻiliʻi, a me ka pololei ma lalo o nā kūlana koʻikoʻi, Ke hoʻomau nei nā substratum seramika alumina i kahi huahana kī, ka hoʻopili ʻana i ka hakahaka ma waena o ka pono, lilo, a me ka hana ʻana i loko o ka ʻeke huahana kikohoʻe hou.

5. Mea hoolako

Alumina Technology Co., Ltd e nānā i ka noiʻi a me ka hoʻomohala ʻana, ka hana ʻana a me ke kūʻai ʻana i ka pauka alumini oxide, nā huahana alumini oxide, alumini oxide crucible, etc., lawelawe i ka uila, seramika, kemika a me nā ʻoihana ʻē aʻe. Mai kona hoʻokumu ʻia ʻana ma 2005, ua kūpaʻa ka hui i ka hāʻawi ʻana i nā mea kūʻai aku i nā huahana a me nā lawelawe maikaʻi loa. Inā ʻoe e ʻimi nei i ke ʻano kiʻekiʻe alumina al2o3, e ʻoluʻolu e hoʻokaʻaʻike mai iā mākou. ([email protected])
Nā huaʻōlelo: Alumina Ceramic Substrates, ʻAlumina Keramika, alumina

ʻO nā ʻatikala a me nā kiʻi a pau mai ka Pūnaewele. Inā loaʻa kekahi pilikia kope, e ʻoluʻolu e kelepona mai iā mākou i ka manawa e holoi ai.

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