IAlumina Ceramic Substrates: ISiseko seSiseko sokuPhakhelwa koMbane oPhezulu kunye noDityaniso lweMicrosystem kubuchwephesha banamhlanje alumina al2o3

1. Izinto eziSisiseko kunye neMigangatho yoYilo lweAlumina Ceramics

1.1 I-Crystallographic kunye ne-Compositional Basics ye-α-Alumina

(IAlumina Ceramic Substrates)

I-alumina ye-ceramic substratums, ubukhulu becala yenziwe nge-aluminiyam oxide enobunzima obukhanyayo (Al ₂ O ₃), zisebenza njengomqolo wokupakishwa kwemveliso ye-elektroniki yanamhlanje ngenxa yokulingana kwazo okumangalisayo kokugqunywa kombane., ukuzinza kwe-thermal, amandla oomatshini, kunye nokwenza.

Esona sigaba sizinzile se-thermodynamically ye-alumina xa kushushu yi-corundum, okanye α-Al Zimbini O ZIMBINI, ekhazimlisa kwihexagonal evaleleke kwilathisi yeoksijini ene-aluminum ion ethatha isibini esithathwini sewebhusayithi ye-octahedral interstitial.

Esi sicwangciso esishinyeneyo seathom sinika ubunzima obuphezulu (Mohs 9), superb ukunxiba ukumelana, kunye ne-inertness eqinileyo yeekhemikhali, ukwenza i-α-alumina ilungele iimeko zokusebenza ezirhabaxa.

Ii-substratum zentengiso zihlala zine-90– 99.8% Al ₂ O EZINE, kunye nezongezo ezincinci zesilika (SiO ZIMBINI), imagnethi (MgO), okanye iioksidi zomhlaba ezingaqhelekanga ezisetyenziswa njengezinto zokuncedisa ekubhengezeni ukuxinana kunye nokulawula ukukhula kweenkozo ngexesha lokuphatha ubushushu obuphezulu..

Iimpawu zokusulungeka okukhulu (umz., 99.5% kwaye ngaphezulu) bonisa ukuxhathisa kombane okumangalisayo kunye nokuhanjiswa kwe-thermal, ngelixa iinguqu ezisezantsi zokucoceka (90– 96%) zibonelela ngezisombululo ezifikelelekayo kwizicelo ezingafunwa kakhulu.

1.2 Ulwakhiwo lweMicrostructure kunye noYilo lweSiphene kuNtembeko lwe-Electronic

Ukusebenza kakuhle kwe-alumina substrates kwiinkqubo zedijithali kusekelwe ngokunzulu kwi-microstructural harmony kunye nokunciphisa imiba.

Isohlwayo, ubume bengqolowa obulinganayo– ngokuqhelekileyo ukusuka 1 ukuya 10 iimicrometers– yenza uzinzo oluthile lomatshini kwaye ihlise amathuba okuzala kwe-crack phantsi koxinzelelo lwe-thermal okanye lomatshini.

I-Porosity, ngokukodwa ii-pores ezidibeneyo okanye ezidityaniswe phezulu, kufuneka incitshiswe njengoko ithoba zombini ukuqina koomatshini kunye nokusebenza kwe-dielectric.

Izicwangciso eziphuculweyo zokucwangcisa ezifana nokusasazwa kweteyiphu, ukucinezela isostatic, kunye ne-sintering elawulwayo emoyeni okanye kwindawo elawulwayo yenza ukuveliswa kwee-substrates ezinobunzima obusondeleyo (> 99.5%) kunye noburhabaxa bommandla ongezantsi 0.5 µm, ibalulekile kwi-metalization yefilimu encinci kunye nokudibanisa intambo.

Ukongeza, Ukwahlulwa kokungcola kwimida yeenkozo kunokubangela ukuvuza kwemisinga okanye ukufuduka kwe-electrochemical phantsi kocalucalulo., ifuna ulawulo olungqongqo malunga nokucoceka kwempahla ekrwada kunye nengxaki zokuthambisa ukwenza ingqibelelo yexesha elide kwindawo efumileyo okanye enombane ophezulu..

2. IiNkqubo zeMveliso kunye neTekhnoloji yoKwakha i-Substratum

( IAlumina Ceramic Substrates)

2.1 Ukusasazwa kweTape kunye ne-Eco-friendly Body Processing

Ukuveliswa kwe-alumina ye-ceramic substrates kuqala ngomsebenzi wokulungiselela udaka olusasazeke kakhulu oluqulethe i-submicron Al ₂ O ezintathu zomgubo., izibophelelo eziphilayo, iiplasticizers, abasasaza, kunye nezinyibilikisi.

Olu daka lucutshungulwa ngokusasazwa kwe-tape– indlela eqhubekayo apho ukunqunyanyiswa kufakwa phezulu kwifilimu ehambisayo ehambisa ifilimu kusetyenziswa iblade yonyango echanekileyo ukufezekisa ubukhulu obufanayo., ngokwesiqhelo phakathi 0.1 mm kwaye 1.0 mm.

Emva kokuchithwa kwe-solvent, isiphumo “tape eco-friendly” ubhetyebhetye kwaye unokubethwa ngenqindi, yombiwa, okanye i-laser-cut ukwenza ngokuvuleka koqhagamshelo oluthe tye.

Iileya ezininzi zinokuthi zenziwe nge-laminated ukuvelisa i-substrates ye-multilayer yokulinganisa isekethe entsonkothileyo, Nangona uninzi lwezicelo zentengiso zisebenzisa uqwalaselo lomaleko omnye ngenxa yokuseta umva kunye nokuqwalaselwa kophuhliso lobushushu..

Iiteyiphu ezilungele imeko-bume ke ngoko zibotshwa ngobuchule ukuze kupheliswe izongezo ze-organic kunye nokuqhekeka okulawulwayo kwe-thermal ngaphambi kokuba kutyiwe okokugqibela..

2.2 I-Sintering kunye ne-Metallization yeNdibaniselwano yeSekethe

I-Sintering yenziwa emoyeni kumaqondo obushushu phakathi 1550 ° C kunye 1650 °C, apho ukusasazwa kombuso oqinileyo kuqhuba ukususwa kwe pore kunye nokucolwa kweenkozo ukuze kuzuzwe ukuxinana okupheleleyo.

Ukuncipha ngokuthe ngqo kuyo yonke i-sintering– ngokwesiqhelo 15– 20%– idinga uqikelelo oluchanekileyo kwaye lwenzelwe kwisitayile seteyiphu ezilungele imeko-bume ukwenza ukuchaneka komgangatho othile we-substratum yokugqibela..

Ukuthobela ukuhlamba, i-metallization ifakwe kwiimpawu zokudala, iipads, kunye ne-vias.

2 iindlela eziphambili zongamela: ushicilelo lwefilimu eshinyeneyo kunye nokubekwa kwefilim ebhityileyo.

Kwinguqulelo yefilimu eshinyeneyo, iintlama ezinomgubo wentsimbi (umz., i-tungsten, molybdenum, okanye ii-alloys zesilivere-palladium) ziprintwa kwisikrini kwi-substratum kwaye ziqhutyelwe kwindawo yokunciphisa i-ambience ukuphuhlisa ixesha elide, abaqhubi be-high-adhesion.

Ngoxinaniso oluphezulu okanye usetyenziso lwefrikhwensi ephezulu, Iinkqubo zefilimu ezibhityileyo ezifana nokutshiza okanye ukuchithwa zisetyenziselwa ukuhla intlawulo yebhondi. (umz., titanium okanye chromium) ithotyelwe ngobhedu okanye igolide, eyenza ipateni ye-sub-micron ngokusebenzisa i-photolithography.

I-Vias igcwele iipastes eziqhubayo kwaye yagxothwa ukuphuhlisa uqhagamshelo lombane phakathi kweeleya kwizitayile zamalayile amaninzi..

3. ImiGangatho yokuSebenza kunye neeMetrics eziSebenzayo kwiZixhobo zoMbane

3.1 Imikhwa yeThermal kunye noMbane phantsi koxinzelelo olusebenzayo

I-Alumina substrates ixabiswa ngenxa yokudibanisa kwabo okunenzuzo yemodareyitha ye-thermal conductivity (20– 35 W/m · K for 96– 99.8% Al ₂ O EZINTATHU), eyenza kube lula ukuchithwa okufudumeleyo okuthembekileyo kwizixhobo zamandla, kunye nomthamo ophezulu wokuxhathisa (> 10 ¹⁴ Ω · iisentimitha), Ukuqinisekisa ukuvuza okuncinci okwangoku.

I-dielectric constant (εᵣ ≈ 9– 10 e 1 MHz) ikhuselekile kubushushu obubanzi kunye nohlobo oluqhelekileyo, izenza zifaneleke kwiisekethe zefrikhwensi ephezulu ukuya kuthi ga kwii-ghzs ezininzi, nangona izixhobo ezisezantsi-k ezifana nobunzima bokukhanya kwe-aluminiyam nitride zikhethwa kwizicelo ze-mm-wave.

I-coefficient yophuhliso lwe-thermal (CTE) yealumina (~ 6.8– 7.2 ppm/K) ihambelana kakuhle ne-silicon (~ 3 ppm/K) kunye neealloyi zokupakisha ezithile, ukunciphisa uxinzelelo lwe-thermo-mechanical ngexesha lokusebenza kwegajethi kunye nokuhamba ngebhayisikili eshushu.

Nangona kunjalo, Ukungafani kwe-CTE kunye nesilicon kuhlala kuyingxaki kwi-flip-chip kunye ne-diye-ncamathisela ukuseta ngokuthe ngqo, ngokuqhelekileyo ibiza abangeneleli abathobelayo okanye iimveliso ezingagcwalisi kakhulu ukunciphisa ukusilela kokudinwa.

3.2 Ukusebenza koomatshini kunye noKuhlala ixesha elide kwendalo

Ngoomatshini, i-alumina substratum ibonisa amandla aphezulu okuguquguquka (300– 400 MPa) kunye nozinzo olubalaseleyo lomgangatho phantsi kwamaqashiso, ukuvumela ukusetyenziswa kwazo kwizinto zombane eziluqilima kwi-aerospace, imoto, kunye neenkqubo zolawulo lwezorhwebo.

Abakwazi ukungcangcazela, umothuko, kwaye urhubuluze kumaqondo obushushu anyusiweyo, ukugcina uzinzo lwesakhiwo kangangoko 1500 ° C kwindawo epholileyo.

Kwimozulu efumileyo, Ucoceko oluphezulu lwe-alumina lutyhila ukufunxa okuncinci kobumanzi kunye nokumelana okubalaseleyo kwintshukumo ye-ion, ukwenza ukuthembeka kwexesha elide kwizicelo zangaphandle kunye nokufuma okuphezulu.

Ukuqina komphezulu ngokunjalo kukhusela ngokuchasene nomonakalo owenziwe ngoomatshini ngexesha lokuphatha kunye nokudibanisa, nangona unyango kufuneka luthatyathwe ukunqanda ukuqhekeka komphetho ngenxa yokuqina okusisiseko.

4. Usetyenziso lwezoShishino kunye nempembelelo yobuChwepheshe kuwo onke amaCandelo

4.1 I-Electronics yamandla, Iimodyuli zeRF, kunye neZixhobo zeMoto

I-Alumina ceramic substrates zikho kuyo yonke indawo kwiimodyuli zamandla ze-elektroniki, equka isango eligqunyiweyo le-bipolar transistors (Ii-IGBTs), Ii-MOSFETs, kunye nabalungisi, apho banikezela ukuhlukaniswa kombane ngelixa bekhuthaza ukuhanjiswa kobushushu kwiindawo zokufudumala.

Kumaza kanomathotholo (RF) kunye neesekethe ze-microwave, zisebenza njengeenkqubo zomboneleli-nkonzo kwiisekethe ezidibeneyo ezixubileyo (HICs), umphezulu wamaza acoustic (WABONA) izihluzi, kunye nothungelwano lwe-eriyali yokutya ngenxa yamakhaya abo e-dielectric akhuselekileyo kunye nokunciphisa ilahleko ye-tangent.

Kwimarike yemoto, I-alumina substratum isetyenziswa kwizixhobo zokulawula injini (Ii-ECUs), izicwangciso zoluvo, kunye nelori yombane (EV) abaguquli bamandla, apho zimelana nobushushu, ibhayisekile eshushu, kunye nokuchanabeka ngokuthe ngqo kulwelo olutshabalalisayo.

Ukuthembeka kwabo phantsi kweengxaki ezinzima kubenza babaluleke kwiinkqubo ezibaluleke kakhulu zokhuseleko ezifana ne-anti-lock braking (UMSULU WESISU) kunye neenkqubo zoncedo lwabaqhubi (I-ADAS).

4.2 Izixhobo zonyango, I-Aerospace, kunye neZisombululo zeMicro-Electro-Mechanical ezikhulayo

Ngaphandle komthengi kunye ne-elektroniki yezoshishino, I-alumina substratum isetyenziswa kwizixhobo zeklinikhi ezifakelweyo ezifana ne-pacemakers kunye ne-neurostimulators., apho ukutywinwa kwe-hermetic kunye ne-biocompatibility ibalulekile.

Kwi-aerospace kunye nokukhusela, zisetyenziswa kwii-avionics, iinkqubo zerada, kunye neemodyuli zokusebenzisana ngesathelayithi ngenxa yokumelana nemitha kunye nokuzinza kwi-vacuum cleaner setting.

Ngaphaya koko, I-alumina isetyenziswa ngakumbi njengenkqubo yesakhiwo kunye nokukhusela kwiinkqubo ze-micro-electro-mechanical systems (MEMS), equka abenzi boxinzelelo, i-accelerometers, kunye nezixhobo ze-microfluidic, apho ukungabikho kweekhemikhali kunye nokuhambelana nokuphathwa kwefilimu encinci kunenzuzo.

Njengoko iinkqubo zedijithali zihlala zifuna ubukhulu obukhulu bamandla, ukwenziwa kweminiaturization, kunye nokuthembeka phantsi kweemeko ezinzima, I-alumina ye-ceramic substratums iyaqhubeka ibe yimveliso yelitye elingundoqo, ukudibanisa isithuba phakathi kokusebenza kakuhle, iindleko, kunye nokwenza izinto ezintsha kwipakethe yemveliso yedijithali.

5. Umthengisi

I-Alumina Technology Co., Ltd igxile kuphando kunye nophuhliso, ukuveliswa kunye nokuthengiswa kwe-aluminium oxide powder, iimveliso ze-aluminium oxide, i-aluminium oxide crucible, njl., ukusebenzela i-elektroniki, iiseramikhi, Iikhemikhali kunye namanye amashishini. Ukususela ekusekweni kwayo kwi 2005, inkampani izibophelele ekuboneleleni abathengi ngezona mveliso kunye neenkonzo ezingcono. Ukuba ujonge umgangatho ophezulu iamina al2o3, nceda uzive ukhululekile ukuqhagamshelana nathi. ([email protected])
Iithegi: IAlumina Ceramic Substrates, IiCeramics zeAlumina, ialumina

Onke amanqaku kunye nemifanekiso avela kwi-Intanethi. Ukuba kukho nayiphi na imiba ye-copyright, nceda uqhagamshelane nathi ngexesha lokucima.

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