I-Alumina Ceramic Substrates: Amandla Ayisisekelo Wokufaka Okuphezulu Kwe-Electronic Packaging kanye Nokuhlanganiswa Kwe-Microsystem ku-Modern Technology alumina al2o3

1. Okubalulekile Okubalulekile kanye Nezimfanelo Zokwakha Ze-Alumina Ceramics

1.1 Isisekelo se-Crystallographic kanye ne-Compositional ye-α-Alumina

(I-Alumina Ceramic Substrates)

I-Alumina Ceramic substratums, ikakhulukazi yenziwe nge-lightweight aluminium oxide (Al ₂ O ₃), zisebenza njengomgogodla wokupakishwa kwemikhiqizo yesimanje ye-elekthronikhi ngenxa yokulingana kwazo okumangalisayo kokufakwa kukagesi, ukuzinza okushisayo, amandla mechanical, kanye nokwenza.

Isigaba esizinze kakhulu se-thermodynamically se-alumina ekushiseni i-corundum, noma α-Al Two O TWO, elicwebezela ku-hexagonal close-packed oxygen latticework ene-aluminium ion ethatha izingxenye ezimbili kwezintathu zamawebhusayithi e-octahedral interstitial.

Lolu hlelo oluwugqinsi lwe-athomu lunikeza ubulukhuni obuphezulu (Mohs 9), superb ukugqoka ukumelana, kanye nokungabi namandla kwamakhemikhali, ukwenza i-α-alumina ifaneleke ezindaweni zokusebenza ezimbi.

Ama-substratum ezohwebo ngokuvamile aqukethe ama-90– 99.8% Al ₂ O EZINE, ngezithako ezincane ze-silica (SIO LESIBILI), i-magnesia (MgO), noma ama-earth oxides angajwayelekile asetshenziswa njengezinsiza-sintering ukukhangisa ukuminyana nokulawula ukukhula okusanhlamvu ngesikhathi sokuphatha izinga lokushisa eliphezulu.

Izimfanelo zokuhlanzeka okukhulu (isib., 99.5% futhi phezu) bonisa ukumelana nogesi okuphawulekayo kanye ne-thermal conductivity, kuyilapho ukuhluka okumsulwa okuphansi (90– 96%) nikeza izixazululo ezithengekayo zezicelo ezingafuneki kangako.

1.2 I-Microstructure kanye ne-Defect Design for Electronic Reliability

Ukusebenza kahle kwama-alumina substrates ezinhlelweni zedijithali kusekelwe ngokuqinile ekuvumelaneni kwe-microstructural kanye nokunciphisa udaba.

Inhlawulo, equiaxed okusanhlamvu isakhiwo– ngokuvamile kusukela 1 ku 10 ama-micrometer– yenza ukuzinza okuthile kwemishini futhi yehlise amathuba okuzalanisa i-crack ngaphansi kokukhathazeka okushisayo noma kwemishini.

I-Porosity, ikakhulukazi izimbotshana ezixhumene noma ezixhumeke phezulu, kufanele kuncishiswe njengoba kwehlisa kokubili ukuqina komshini nokusebenza kwe-dielectric.

Amasu okucubungula athuthukile njengokusabalalisa itheyiphu, ukucindezela kwe-isostatic, kanye ne-sintering elawulwayo emoyeni noma ezindaweni eziphethwe kunika amandla ukukhiqizwa kwama-substrates anogqinsi olucishe lufane nethiyori (> 99.5%) kanye nobukhulu bendawo ngezansi 0.5 µm, kubalulekile ekwenzeni ifilimu encane i-metalization kanye nokuhlanganisa izintambo.

Ukwengeza, ukuhlukaniswa kokungcola emingceleni yokusanhlamvu kungaholela ekuvuzeni kwamanzi noma ukufuduka kwe-electrochemical ngaphansi kokubandlulula, kudinga ukulawula okuqinile kokuhlanzeka kwempahla eluhlaza kanye nezinkinga ze-sintering ukwenza ubuqotho obuhlala isikhathi eside endaweni emanzi noma ene-voltage ephezulu.

2. Izinqubo Zokukhiqiza kanye Nobuchwepheshe Bokwakhiwa Kwe-Substratum

( I-Alumina Ceramic Substrates)

2.1 Ukusakazeka kwe-Tape kanye Nokucubungula Komzimba Eco-friendly

Ukukhiqizwa kwe-alumina ceramic substrates kuqala ngomsebenzi wokulungiselela we-slurry ehlakazeke kakhulu equkethe i-submicron Al ₂ O impushana emithathu., izibophezelo eziphilayo, ama-plasticizers, abahlakazayo, kanye nezincibilikisi.

Lolu daka lucutshungulwa ngendlela yokusabalalisa itheyiphu– indlela eqhubekayo lapho ukumiswa kufakwa phezulu kwefilimu yenkampani yenethiwekhi ethuthela kwenye indawo kusetshenziswa i-blade yezokwelapha enembile ukuze kuzuzwe ukushuba okufanayo, ngokuvamile phakathi 0.1 mm futhi 1.0 mm.

Ngemuva kokukhishwa kwe-solvent, umphumela “i-eco-friendly tape” iyavumelana nezimo futhi ingashaywa, kwabholwa, noma i-laser-cut ukuze yakhe izimbobo zokuxhumanisa okuqondile.

Izendlalelo eziningi zingase zenziwe i-laminated ukuze kukhiqizwe ama-substrates ezendlalelo eziningi ukuze kufaniswe isekethe eyinkimbinkimbi, nakuba iningi lezinhlelo zokusebenza zezentengiso zisebenzisa ukulungiselelwa kongqimba olulodwa ngenxa yokukubuyisela emuva kanye nokucatshangelwa kokuthuthukiswa kokushisa..

Amateyipu alungele imvelo abe esekhishwa ngokucophelela ukuze kuqedwe izithasiselo eziphilayo ngokuhlakazeka okulawulwayo okushisayo ngaphambi kokucwiliswa kokugcina..

2.2 I-Sintering and Metallization for Circuit Combination

I-Sintering yenziwa emoyeni emazingeni okushisa aphakathi nendawo 1550 ° C futhi 1650 °C, lapho ukusakazeka kombuso oqinile kushayela ukuqedwa kwezimbotshana kanye nokuhwaya okusanhlamvu ukuze kufinyelele ukuminyana okuphelele.

Ukuncipha okuqondile kulo lonke i-sintering– ngokuvamile 15– 20%– zidinga ukubikezelwa ngokunembile futhi zenzelwe isitayela samateyipu avumelana nemvelo ukwenza ukunemba okuthile kobukhulu be-substratum yokugcina..

Ukuhambisana ne-sintering, i-metalization ifakwa ekudaleni imikhondo ye-conductive, amaphedi, futhi vias.

2 amasu ayisihluthulelo abusa: ukuphrinta kwefilimu ewugqinsi kanye nokubekwa kwefilimu emincane.

Ku-thick-film emisha, ama-paste anezimpushana zensimbi (isib., i-tungsten, i-molybdenum, noma ama-alloys esiliva-palladium) aphrintwe isikrini ku-substratum futhi aqhutshwe ngokuhlanganyela endaweni enciphisayo ukuze athuthuke isikhathi eside, high-adhesion conductors.

Okwezinhlelo zokusebenza zokuminyana okuphezulu noma imvamisa ephezulu, izinqubo zefilimu elincanyana njengokufafaza noma ukulahla zisetshenziselwa ukwehlisa izendlalelo zebhondi yokukhokha. (isib., i-titanium noma i-chromium) kuhambisana nethusi noma igolide, inika amandla iphethini ye-sub-micron ngokusebenzisa i-photolithography.

I-Vias igcwele ama-pastes aguquguqukayo futhi ixoshiwe ukuze kuthuthukiswe ukuxhumana kukagesi phakathi kwezendlalelo ngezitayela zezendlalelo eziningi..

3. Izimfanelo Ezisebenzayo kanye Nezimethrikhi Zokusebenza Ezisetshenziswa Kagesi

3.1 Imikhuba Eshisayo Nekagesi Ngaphansi Kokucindezeleka Okusebenzayo

Ama-substrates e-Alumina aziswa ngenhlanganisela yawo enenzuzo yokuguquguquka okuphakathi kwe-thermal (20– 35 W/m · K ngo-96– 99.8% Al ₂ O EZINTATHU), okwenza kube nokwenzeka ukuchithwa okufudumele okuthembekile kumathuluzi kagesi, kanye nenani eliphakeme le-resistivity (> 10 ¹⁴ Ω · amasentimitha), ukuqinisekisa ukuvuza kwamanje.

I-dielectric constant yabo (εᵣ ≈ 9– 10 kwe 1 MHz) ivikelekile phezu kwezinga lokushisa elibanzi nokuhlukahluka okujwayelekile, ukuwenza afaneleke kumasekhethi anemvamisa ephezulu afika kuma-ghz amaningi, nakuba izinto eziphansi-k ezifana ne-aluminium nitride yesisindo esikhanyayo zikhethelwa izinhlelo zokusebenza ze-mm-wave.

I-coefficient yokuthuthukiswa kokushisa (I-CTE) kwe-alumina (~ 6.8– 7.2 ppm/K) ihambisana kahle ne-silicon (~ 3 ppm/K) kanye nama-alloys athile okupakisha, ukwehlisa ukungezwani kwe-thermo-mechanical ngesikhathi sokusebenza kwegajethi kanye nokuhamba ngebhayisikili okushisayo.

Nokho, ukungafani kwe-CTE ne-silicon kuhlala kuyinkinga ku-flip-chip kanye nokusetha okunamathiselwe kwe-die-attach okuqondile, ngokuvamile ibiza izihlanganisi ezithobelayo noma imikhiqizo engagcwalisi kakhulu ukuze kuncishiswe ukuhluleka kokukhathala.

3.2 Ukusebenza Kwemishini Nokuqina Kwendawo Ezungezile

Ngomshini, ama-alumina substratum akhombisa amandla aphezulu okuguquguquka (300– 400 I-MPa) kanye nokuzinza okuhle kakhulu kwe-dimensional ngaphansi kwenkatho, okuvumela ukusetshenziswa kwabo kuma-elekthronikhi aqinile endaweni ye-aerospace, imoto, kanye nezinhlelo zokulawula ezohwebo.

Azikwazi ukudlidliza, ukwethuka, futhi zingene emazingeni okushisa aphakeme, ukugcina ukuzinza kwesakhiwo njengoba 1500 ° C kuma-ambiences angasebenzi.

Ezimoyeni ezinomswakama, i-high-purity alumina iveza ukumuncwa okuncane kobumanzi kanye nokumelana okuvelele kokunyakaza kwe-ion, ukwenza ubuqotho obuthile besikhathi eside ezinhlelweni zangaphandle nezinomswakama ophezulu.

Ukuqina kobuso nakho kuvikela ngokumelene nokulimala komshini ngesikhathi sokuphatha nokuhlanganisa, nakuba ukwelashwa kufanele kuthathwe ukuze kuvinjelwe ukuqhekeka onqenqemeni ngenxa yokuqina okuyisisekelo.

4. Izicelo Zezimboni kanye Nethonya Lobuchwepheshe Emikhakheni Yonkana

4.1 Amandla kagesi, Amamojula we-RF, kanye Nezinsimbi Zezimoto

Ama-substrates e-alumina ceramic atholakala yonke indawo kumamojula wamandla kagesi, ehlanganisa ama-transistors e-bipolar esangweni (I-IGBTs), Ama-MOSFET, kanye nezilungisi, lapho behlinzeka ngokuhlukaniswa kukagesi ngenkathi bekhuthaza ukudluliswa kokushisa kumasinki okufudumala.

Kumafrikhwensi omsakazo (I-RF) kanye namasekethe e-microwave, zisebenza njengezinhlelo zabahlinzeki besevisi kumasekethe ahlanganisiwe ayingxube (Ama-HIC), indawo ye-acoustic wave (SAW) izihlungi, kanye namanethiwekhi okuphakelayo kwe-antenna ngenxa yezindlu zawo ezivikelekile ze-dielectric kanye ne-tangent yokulahlekelwa encishisiwe.

Emakethe yezimoto, Ama-alumina substratum asetshenziswa kumadivayisi okulawula injini (Ama-ECU), izinhlelo zezinzwa, kanye neloli likagesi (EV) iziguquli zamandla, lapho ezimelana khona nokushisa, ukuhamba ngebhayisikili okushisayo, kanye nokuchayeka ngokuqondile oketshezini olubhubhisayo.

Ukwethenjwa kwazo ngaphansi kwezinkinga ezinzima kuzenza zibaluleke ezinhlelweni ezibucayi zokuphepha ezifana ne-anti-lock braking (UMSIPHA WESISU) kanye nezinhlelo zosizo lwabashayeli ezithuthukile (I-ADAS).

4.2 Izinsimbi Zokwelapha, I-Aerospace, kanye ne-Arising Micro-Electro-Mechanical Solutions

Ngaphandle kwama-electronics amakhasimende nezimboni, ama-alumina substratum asetshenziswa kumadivayisi omtholampilo afakelwayo njengama-pacemaker nama-neurostimulators., lapho ukubekwa uphawu kwe-hermetic kanye ne-biocompatibility kubalulekile.

In aerospace and defense, they are made use of in avionics, radar systems, and satellite interaction modules as a result of their radiation resistance and stability in vacuum cleaner settings.

Ngaphezu kwalokho, alumina is increasingly used as a structural and protecting system in micro-electro-mechanical systems (MEMS), consisting of pressure sensors, accelerometers, and microfluidic tools, where its chemical inertness and compatibility with thin-film handling are beneficial.

As digital systems remain to require greater power thickness, i-miniaturization, and integrity under severe conditions, alumina ceramic substratums continue to be a keystone product, linking the space in between efficiency, expense, and manufacturability in innovative digital product packaging.

5. Umphakeli

Le nkampani Alumina Technology Co., Ltd., Ltd igxile ocwaningweni nasekuthuthukisweni, ukukhiqizwa nokudayiswa kwe-aluminium oxide powder, imikhiqizo ye-aluminium oxide, i-aluminium oxide crucible, njll., ukusebenzela ugesi, izitsha zobumba, izimboni zamakhemikhali nezinye. Selokhu yasungulwa ngo 2005, inkampani izibophezele ekuhlinzekeni amakhasimende ngemikhiqizo namasevisi angcono kakhulu. Uma ufuna izinga eliphezulu i-alumina al2o3, sicela ukhululeke ukuxhumana nathi. ([email protected])
Omaka: I-Alumina Ceramic Substrates, I-Alumina Ceramics, i-alumina

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