E taaihia te mau hu'ahu'a mana i te mau haaatiraa i rapae e te mau tao'a, and their performance depends on the support of the product packaging. In high-power situations, power chips are typically packaged as power components. Chip interconnection describes the electrical link on the top surface area of the chip, which is generally aluminum bonding wire in standard components. ^
Conventional power component bundle cross-section
I teie nei, industrial silicon carbide power components still primarily make use of the packaging modern technology of this wire-bonded standard silicon IGBT component. They face issues such as big high-frequency parasitic criteria, inadequate warmth dissipation capability, low-temperature resistance, and insufficient insulation toughness, which restrict making use of silicon carbide semiconductors. The display screen of exceptional performance. No te faatitiaifaro i teie mau fifi e no te faaohipa hope roa i te mau maitai rahi o te mau hu'ahu'a silicon carbide, aita i maoro a'enei, e rave rahi mau ravea apî e te mau ohipa apî no te mau ravea uira silicon carbide tei itehia mai.
Te hoê rave'a no te taatiraa i te mau rave'a no te uira
(Fiu (te) Te taairaa e te (b) Cu Clip hoho'a no te hamaniraa i te rave'a mana (aui) uaea parahi e (ti'a) Te rave'a no te taatiraa i te reni parahi)
Ua hamanihia mai te mau tao'a taa ê na roto i te taura auro 2001 no te mama i te taura aluminium (Ti'āpa) te taairaa i roto 2006, te taura parahi 2011, e Cu Clip i te 2016. Ua hamanihia mai te mau taura iti mai te mau taura auro e tae atu i te mau aho parahi, e te puai faaûru, o te faaitiraa ïa i te hoo; Ua hamanihia mai te mau rave'a puai rahi no roto mai i te mau aho aluminium (mau hu'ahu'a) ki te mau hoho'a, e te puai faaûru, o te faarahiraa ïa i te aravihi o te mau mea. Te teitei o te mana, te rahi noa ' tura te mau titauraa.
Ua riro te Cu Clip ei tao'a parahi, api parahi. Bond, e aore râ, a tatara i te taairaa, o te hoê ïa ravea no te tapo'i i te hoê tao'a o te faaohipa i te hoê e'aturu parahi puai tei faaûruhia no te faatumu i nia i te mau hu'ahu'a e te mau pine. Ia faaauhia i te mau ravea tahito no te tapo'i i te mau tao'a, E mau maitai i muri nei i roto i te mau rave'a aravihi apî:
1. Ua hamanihia mai te taairaa i rotopu i te afata e te mau pine na roto mai i te mau api parahi, te hea, i te hoê faito taa ê, E mono te reira i te rave'a matauhia no te taatiraa i rotopu i te afata e te mau pine. Āre'a, te hoê faanahoraa taa ê no te patoi, te taheraa teitei i teie nei, e e nehenehe e fana'o i te hoê aratairaa veavea maitai a'e.
2. Aita e titauhia ia tapo'ihia te vahi no te tape'araa i te mata'i, o te nehenehe e haamâu'a roa i te moni no te tapo'iraa i te ario e te tapo'iraa ario ino.
3. The product look is completely regular with normal products and is mostly utilized in servers, portable computer systems, batteries/drives, graphics cards, motors, power products, and various other fields.
Cu Clip has 2 bonding methods.
All copper sheet bonding method
Both the Gate pad and the Source pad are clip-based. This bonding technique is much more costly and complicated, yet it can accomplish much better Rdson and much better thermal results.
( copper strip)
Copper sheet plus cord bonding technique
The resource pad utilizes a Clip approach, and the Gate makes use of a Cord approach. This bonding method is somewhat cheaper than the all-copper bonding approach, conserving wafer area (appropriate to really small gateway locations). The procedure is less complex than the all-copper bonding method and can obtain much better Rdson and much better thermal result.
Vendor of Copper Strip
Hau atu i te 12 Te mau matahiti ite i roto i te parururaa i te ito e te faahoturaa i te mau rave'a aravihi apî. E farii oia i te aufau na roto i te Credit Card, T/T, Te fenua Tooa o te râ e te Paypal. E hapono o Trunnano i te mau tao'a i te feia hoo tao'a na te ara na roto i te FedEx, DHL, na roto i te reva, e aore râ, na ni'a i te moana. If you are finding parahi i te ounce, Aita e feaaraa ia farerei ia matou e ia hapono mai i te hoê uiraa.
A ui ia matou