Chips energía gi 'bu̲hu̲ conectados ma circuitos externos a través de ar embalaje ar producto, ne ár rendimiento bi jagu̲ju̲ ar soporte ar envase producto. ja mextha ar potencia, virutas energía ar empaquetan típicamente komongu ar componentes nts'edi. interconexión viruta pede ar enlace eléctrico jar área superficial mäs xi ngu ar viruta, nä'ä nu'bu̲ da nthe̲hu̲ 'ra ar alambre enlace aluminio jar componentes estándar. ^
sección transversal ar paquete componentes nts'edi convencionales
da la actualidad, componentes energía ar carburo silicio industrial Tobe principalmente o̲t'e njapu'befi tecnología embalaje nuna componente IGBT silicio estándar unido alambre. enfrentan ya hñäki komongu ya dätä parámetros parásitos mextha frecuencia, mfeni disipación pa inadecuada, resistencia xí hñets'i'i mpat'i, ne resistencia aislamiento insuficiente, da restringen njapu'befi ya semiconductores carburo silicio. Ar exhibición rendimiento excepcional. In order to resolve these troubles and completely make use of the big potential benefits of silicon carbide chips, many new packaging innovations and services for silicon carbide power components have emerged recently.
Silicon carbide power module bonding approach
(Figure (a) Wire bonding and (b) Cu Clip power module structure diagram (left) copper wire and (right) copper strip connection process)
Bonding products have created from gold cord bonding in 2001 to light weight aluminum cord (tape) bonding in 2006, copper cord bonding in 2011, and Cu Clip bonding in 2016. Low-power tools have actually developed from gold cords to copper wires, and the driving force is price reduction; high-power tools have actually developed from aluminum wires (strips) to Cu Clips, and the driving force is to boost item efficiency. The higher the power, the greater the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that makes use of a strong copper bridge soldered to solder to attach chips and pins. Compared to traditional bonding product packaging approaches, Cu Clip technology has the following advantages:
1. The connection in between the chip and the pins is constructed from copper sheets, which, to a particular level, replaces the typical cable bonding technique between the chip and the pins. ir, a special plan resistance worth, higher present flow, and far better thermal conductivity can be obtained.
2. The lead pin welding location does not require to be silver-plated, which can totally conserve the expense of silver plating and poor silver plating.
3. The product look is completely regular with normal products and is mostly utilized in servers, portable computer systems, batteries/drives, graphics cards, motors, power products, and various other fields.
Cu Clip has 2 bonding methods.
All copper sheet bonding method
Both the Gate pad and the Source pad are clip-based. This bonding technique is much more costly and complicated, yet it can accomplish much better Rdson and much better thermal results.
( copper strip)
Copper sheet plus cord bonding technique
The resource pad utilizes a Clip approach, and the Gate makes use of a Cord approach. This bonding method is somewhat cheaper than the all-copper bonding approach, conserving wafer area (appropriate to really small gateway locations). Ar nt'ot'e ar menu complejo nä'ä ar nt'ot'e vinculación ga̲tho cobre ne to da tsoni xingu mäs xi hño Rdson ne xingu mpädi mäs xi resultados térmicos.
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