Chips za nguvu zimeunganishwa na mizunguko ya nje na ufungaji wa bidhaa, and their performance depends on the support of the product packaging. In high-power situations, power chips are typically packaged as power components. Chip interconnection describes the electrical link on the top surface area of the chip, which is generally aluminum bonding wire in standard components. ^
Conventional power component bundle cross-section
Kwa sasa, industrial silicon carbide power components still primarily make use of the packaging modern technology of this wire-bonded standard silicon IGBT component. They face issues such as big high-frequency parasitic criteria, inadequate warmth dissipation capability, low-temperature resistance, and insufficient insulation toughness, ambayo inazuia matumizi ya semiconductors ya silicon carbide. Skrini ya kuonyesha ya utendaji wa kipekee. Ili kutatua shida hizi na kutumia kikamilifu faida kubwa za silicon carbudi chips, ubunifu na huduma nyingi mpya za ufungaji kwa vipengele vya nguvu vya silicon carbide zimeibuka hivi karibuni.
Mbinu ya kuunganisha moduli ya kaboni ya silicon
(Kielelezo (a) Kuunganisha kwa waya na (b) Cu Mchoro wa muundo wa moduli ya nguvu ya klipu (kushoto) waya wa shaba na (kulia) mchakato wa kuunganisha kamba ya shaba)
Bidhaa za kuunganisha zimeundwa kutoka kwa kuunganisha kwa kamba ya dhahabu 2001 kwa uzito mwepesi kamba ya alumini (mkanda) kuunganishwa ndani 2006, kuunganisha kwa kamba ya shaba ndani 2011, na Cu Clip kuunganisha ndani 2016. Zana zenye nguvu kidogo zimetengenezwa kutoka kwa kamba za dhahabu hadi waya za shaba, na nguvu inayosukuma ni kupunguza bei; zana za nguvu ya juu zimetengenezwa kutoka kwa waya za alumini (vipande) kwa Na Klipu, and the driving force is to boost item efficiency. The higher the power, the greater the requirements.
Cu Clip is copper strip, copper sheet. Clip Bond, or strip bonding, is a product packaging procedure that makes use of a strong copper bridge soldered to solder to attach chips and pins. Compared to traditional bonding product packaging approaches, Cu Clip technology has the following advantages:
1. The connection in between the chip and the pins is constructed from copper sheets, ambayo, to a particular level, replaces the typical cable bonding technique between the chip and the pins. Kwa hiyo, a special plan resistance worth, higher present flow, and far better thermal conductivity can be obtained.
2. The lead pin welding location does not require to be silver-plated, which can totally conserve the expense of silver plating and poor silver plating.
3. The product look is completely regular with normal products and is mostly utilized in servers, portable computer systems, batteries/drives, graphics cards, motors, power products, and various other fields.
Cu Clip has 2 bonding methods.
All copper sheet bonding method
Both the Gate pad and the Source pad are clip-based. This bonding technique is much more costly and complicated, yet it can accomplish much better Rdson and much better thermal results.
( copper strip)
Copper sheet plus cord bonding technique
The resource pad utilizes a Clip approach, and the Gate makes use of a Cord approach. This bonding method is somewhat cheaper than the all-copper bonding approach, conserving wafer area (appropriate to really small gateway locations). Utaratibu huo sio ngumu kuliko njia ya kuunganisha shaba yote na inaweza kupata Rdson bora zaidi na matokeo bora zaidi ya mafuta..
Muuzaji wa Ukanda wa Shaba
TRUNNANO ni msambazaji wa surfactant na over 12 uzoefu wa miaka katika uhifadhi wa nishati ya ujenzi wa nano na ukuzaji wa teknolojia ya nano. Inakubali malipo kupitia Kadi ya Mkopo, T/T, West Union na Paypal. Trunnano itasafirisha bidhaa kwa wateja wa ng'ambo kupitia FedEx, DHL, kwa hewa, au kwa bahari. Ikiwa unapata shaba kwa wakia, tafadhali jisikie huru kuwasiliana nasi na kutuma uchunguzi.
Tuulize